Instrukcja obsługi Sandisk PC SN730

Sandisk Dyski półprzewodnikowe (SSD) PC SN730

Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Sandisk PC SN730 (42 stron) w kategorii Dyski półprzewodnikowe (SSD). Ta instrukcja była pomocna dla 11 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek

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PC SN730 NVMe™ SSD

For Generic OEM

PRODUCT MANUAL

00-01-WW-04-00047

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Revision History

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Revision Date Description Reference

1.0 November 22, 2019 Initial release.

Table of Contents

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TABLE OF CONTENTS

1. P ........................................................................................................................... 7REFACE

1.1 Typographical Conventions ............................................................................................................7

1.2 Glossary of Abbreviations and Acronyms......................................................................................7

2. I ................................................................................................................. 8NTRODUCTION

2.1 General Description ........................................................................................................................ 8

2.2 Key Features and Specification.......................................................................................................9

2.3 Functional Description...................................................................................................................10

2.4 Advanced Flash Management .......................................................................................................10

2.4.1 Defect and Error Management ............................................................................................10

2.4.2 Wear Leveling ......................................................................................................................10

2.4.3 Bad Block Management.......................................................................................................10

2.4.4 Background Garbage Collection ........................................................................................10

2.4.5 SLC Cache - nCache 3.0 .......................................................................................................11

2.4.6 Error Correction Layers ........................................................................................................11

3. G P S .................................................................................12ENERAL RODUCT PECIFICATIONS

3.1 Interface .......................................................................................................................................... 12

3.2 Hardware Configuration ................................................................................................................ 12

3.3 Capacity .......................................................................................................................................... 12

4. P .................................................................................................................13ERFORMANCE

5. POWER HARACTERISTICS C ................................................................................................14

5.1 Supply Voltage ............................................................................................................................... 14

5.2 Average Active-Power Consumption........................................................................................... 14

5.3 Operating Power Consumption – Average Maximum ................................................................ 14

5.4 Peak Power and In-Rush Current .................................................................................................. 15

5.5 NVMe Power Management............................................................................................................ 15

5.6 Graceful Power-off Requirements ................................................................................................ 16

6. T T .....................................................................................................17HERMAL HROTTLING

6.1 Self-Thermal Throttling .................................................................................................................. 17

6.2 Denial of Service............................................................................................................................. 17

7. E .....................................................................................................................18NDURANCE

8. SECURITY ........................................................................................................................19

8.1 Password Lock Through TCG Pyrite 2.0 ...................................................................................... 19

8.2 Secure Erase .................................................................................................................................. 20

8.3 Security of Read-Only Mode ........................................................................................................ 20

8.4 Secure Field Firmware Update (FFU)............................................................................................ 21

8.5 Secure Boot .................................................................................................................................... 21

8.6 Secure RMA..................................................................................................................................... 21

9. P S ............................................................................................... 22HYSICAL PECIFICATIONS