Instrukcja obsługi Texas Instruments SN74LVC2G157DCUR


Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Texas Instruments SN74LVC2G157DCUR (27 stron) w kategorii nieskategoryzowany. Ta instrukcja była pomocna dla 22 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC2G157
SCES207N – APRIL 1999 – REVISED MARCH 2019
SN74LVC2G157 Single 2-Line to 1-Line data selector multiplexer
1
1 Features
1
Available in the Texas Instruments
NanoFree™ package
Supports 5-V VCC operation
Inputs accept voltages to 5.5 V
Max tpd of 6 ns at 3.3 V
Low power consumption, 10-µA Maximum I CC
±24-mA Output drive at 3.3 V
Typical VOLP (Output ground bounce)
<0.8 V at VCC = 3.3 V, TA= 25°C
Typical VOHV (Output VOH undershoot)
>2 V at VCC = 3.3 V, TA= 25°C
• Io Supports live insertion, partial-power-down
mode, and back-drive protection
Can be used as a down translator to translate
inputs from a maximum of 5.5 V down
to the VCC Level
Latch-up performance exceeds 100 mA per
JESD 78, Class II
ESD Protection exceeds JESD 22
2000-V Human body model (A114-A)
1000-V Charged-device model (C101)
2 Applications
Barcode scanner
Cable solutions
• E-books
Embedded PC
Field transmitter: temperature or pressure sensors
Fingerprint biometrics
HVAC: Heating, ventilating, and air conditioning
Network-attached storage (NAS)
Server motherboard and PSU
Software dened radio (SDR)
TV: High denition (HDTV), LCD, and digital
Video communications systems
Wireless data access cards, headsets, keyboards,
mice, and LAN cards
3 Description
This single 2-line to 1-line data selector multiplexer is
designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G157 device features a common
strobe (G) input. When the strobe is high, Y is low
and Y is high. When the strobe is low, a single bit is
selected from one of two sources and is routed to the
outputs. The device provides true and complementary
data.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specied for partial-power-down
applications using Io. The Iocircuitry disables the
outputs, preventing damaging current backow
through the device when it is powered down.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC2G157DCT SSOP (8) 2.95 mm × 2.80 mm
SN74LVC2G157DCU VSSOP (8) 2.30 mm × 2.00 mm
SN74LVC2G157YZP DSBGA (8) 1.91 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
2
SN74LVC2G157
SCES207N APRIL 1999 REVISED MARCH 2019
www.ti.com
Product Folder Links: SN74LVC2G157
Submit Documentation Feedback Copyright © 1999–2019, Texas Instruments Incorporated
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Conguration and Functions ......................... 3
6 Specications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics .......................................... 5
6.6 Switching Characteristics ......................................... 6
6.7 Operating Characteristics.......................................... 6
6.8 Typical Characteristics .............................................. 6
7 Parameter Measurement Information .................. 7
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 9
9 Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application ................................................. 10
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 12
11.1 Layout Guidelines ................................................. 12
11.2 Layout Example .................................................... 13
12 Device and Documentation Support ................. 14
12.1 Documentation Support ........................................ 14
12.2 Community Resources.......................................... 14
12.3 Trademarks ........................................................... 14
12.4 Electrostatic Discharge Caution ............................ 14
12.5 Glossary ................................................................ 14
13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may dier from page numbers in the current version.
Changes from Revision M (June 2015) to Revision N Page
Changed YZP package pinout drawing to match mechanical data drawing; and, pin functions description for clarity ........ 3
Added additional thermal metrics for all packages................................................................................................................. 5
Added detailed feature description sections for Standard CMOS Inputs, Balanced High-Drive CMOS Push-Pull
Outputs, and Negative Clamping Diodes. .............................................................................................................................. 8
Added improved Design Requirements and Detailed Design Procedure............................................................................. 10
Changed verbiage to better reect recommendations for this specic device rather than logic devices in general............ 12
Added layout example for the YZP package. ....................................................................................................................... 12
Changes from Revision L (January 2014) to Revision M Page
• Added table.......................................................................................................................................................ESD Ratings 4
• Added ..........................................................................................................................................Thermal Information table. 5
• Added ................................................................................................................................................Typical Characteristics 6
• Added section.....................................................................................Mechanical, Packaging, and Orderable Information 14
Changes from Revision K (January 2007) to Revision L Page
Updated document to new TI data sheet format. ................................................................................................................... 1
Removed table .....................................................................................................................................Ordering Information 1
• Updated ...................................................................................................................................................................Features 1
Added table .............................................................................................................................................Device Information 1
3
2
4 5
1
A VCC
GB
GND
Y A/B
Y
6
7
8
A/B
3
2
5
81
A VCC
B
GND
Y
G
Y
4
6
7
3
SN74LVC2G157
www.ti.com
SCES207N – APRIL 1999 – REVISED MARCH 2019
Product Folder Links: SN74LVC2G157
Submit Documentation Feedback
Copyright © 1999–2019, Texas Instruments Incorporated
5 Pin Conguration and Functions
DCT Package
8-Pin SSOP
Top View
DCU Package
8-Pin VSSOP
Top View
YZP Package
8-Pin DSBGA
Bottom View
Drawing are not to scale. See mechanical drawings for dimensions
Pin Functions
PIN
I/O DESCRIPTION
NAME SSOP,
VSSOP DSBGA
A 1 A1 Input Data Input A
A/B 6 C2 Input Input Selector
B 2 B1 Input Data Input B
G 7 B2 Input Common Strobe Input
GND 4 D1 — Ground
VCC 8 A2 Positive Supply
Y 5 D2 Output Output
Y 3 C1 Output Inverted Output


Specyfikacje produktu

Marka: Texas Instruments
Kategoria: nieskategoryzowany
Model: SN74LVC2G157DCUR
Wysokość produktu: 0.8 mm
Szerokość produktu: 2.1 mm
Głębokość produktu: 2.4 mm
Szerokość opakowania: 180 mm
Wysokość opakowania: 18 mm
Głębokość opakowania: 180 mm
Ilość na paczkę: 3000 szt.
Zakres temperatur (eksploatacja): -40 - 85 °C
Liczba styków: 8
Zakres temperatur (przechowywanie): -65 - 150 °C
Model: Logiczny układ scalony
Rodzaj opakowania: VSSOP
Szerokość (z bolcami): 2.1 mm
Głębokość (z bolcami): 3.2 mm
Wysokość (z bolcami): 0.9 mm

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