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318590-005

Dual-Core Intel® Xeon® Processor

5200 Series

Datasheet

August 2008

2 Dual-Core Intel® Xeon® Processor 5200 Series Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Dual-Core Intel® Xeon® Processor 5200 Series may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel ® 64 architecture. Processors will not operate (including 32-bit operation) without an

Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult

with your system vendor for more information.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible

with all operating systems. Please check with your application vendor.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Xeon, Intel SpeedStep Technology, Intel Core, and the Intel logo are trademarks or registered trademarks of

Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 5200 Series Datasheet 3

Contents

1 Introduction ..............................................................................................................9

1.1 Terminology ..................................................................................................... 10

1.2 State of Data.................................................................................................... 13

1.3 References ....................................................................................................... 13

2 Dual-Core Intel® Xeon® Processor 5200 Series Electrical Specifications................. 15

2.1 Front Side Bus and GTLREF ................................................................................ 15

2.2 Power and Ground Lands.................................................................................... 15

2.3 Decoupling Guidelines........................................................................................ 16

2.3.1 VCC Decoupling...................................................................................... 16

2.3.2 VTT Decoupling ...................................................................................... 16

2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16

2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17

2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17

2.4.2 PLL Power Supply................................................................................... 18

2.5 Voltage Identification (VID) ................................................................................ 18

2.6 Reserved, Unused, and Test Signals..................................................................... 21

2.7 Front Side Bus Signal Groups.............................................................................. 22

2.8 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24

2.9 Test Access Port (TAP) Connection....................................................................... 24

2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24

2.10.1 DC Characteristics.................................................................................. 24

2.10.2 Input Device Hysteresis .......................................................................... 25

2.11 Mixing Processors.............................................................................................. 26

2.12 Absolute Maximum and Minimum Ratings ............................................................. 26

2.13 Processor DC Specifications ................................................................................ 27

2.13.1 Flexible Motherboard Guidelines (FMB)...................................................... 27

2.13.2 VCC Overshoot Specification .................................................................... 35

2.13.3 Die Voltage Validation............................................................................. 35

2.14 AGTL+ FSB Specifications................................................................................... 36

3 Mechanical Specifications ........................................................................................ 39

3.1 Package Mechanical Drawings ............................................................................. 39

3.2 Processor Component Keepout Zones................................................................... 43

3.3 Package Loading Specifications ........................................................................... 43

3.4 Package Handling Guidelines...............................................................................44

3.5 Package Insertion Specifications.......................................................................... 44

3.6 Processor Mass Specifications ............................................................................. 44

3.7 Processor Materials............................................................................................ 44

3.8 Processor Markings............................................................................................ 44

3.9 Processor Land Coordinates ................................................................................ 45

4 Land Listing............................................................................................................. 47

4.1 Dual-Core Intel® Xeon® Processor 5200 Series Pin Assignments ............................ 47

4.1.1 Land Listing by Land Name...................................................................... 47

4.1.2 Land Listing by Land Number................................................................... 57

5 Signal Definitions .................................................................................................... 67

5.1 Signal Definitions .............................................................................................. 67

6 Thermal Specifications ............................................................................................ 75

6.1 Package Thermal Specifications........................................................................... 75

6.1.1 Thermal Specifications ............................................................................ 75

6.1.2 Thermal Metrology ................................................................................. 84

6.2 Processor Thermal Features................................................................................ 85

Specyfikacje produktu

Marka:	Lenovo
Kategoria:	edytor
Model:	Intel Xeon E5205
Przeznaczenie:	Serwer/stacja robocza
Typ procesora:	Intel® Xeon®
Model procesora:	E5205
Gniazdo procesora:	LGA 771 (Socket J)
Maksymalna temperatura eksploatacji:	66 °C
Typ pamięci procesora:	L2
Cache procesora:	6 MB
Litografia procesora:	45 nm
Tryb pracy procesora:	64-bit
Termiczny układ zasilania (TDP):	65 W
Stepping:	E0
Kod procesora:	SLBAU
Magistrala systemowa:	1066 MHz
Współczynnik Magistrala/Rdzeń:	7
Pudełko:	Nie
Częstotliwość bazowa procesora:	1.86 GHz
Segment rynku:	Serwer
Zakres napięcia VID:	0.950 - 1.212 V
Prędkość pamięci podręcznej L2:	1.86 GHz