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Intel® Celeron® Mobile Processor

Dual-Core on 45-nm Process

Datasheet

For Platforms Based on Mobile Intel® 4 Series Express Chipset Family

September 2009

Document Number: 321111-003

2 Datasheet

Legal Lines and Disclaimers

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OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE

FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics

of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with

this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Enhanced Intel SpeedStep® Technology for specified units of this processor is available. See the Processor Spec Finder at http://

processorfinder.intel.com or contact your Intel representative for more information.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

This device is protected by U.S. patent numbers 5,315,448 and 6,516,132, and other intellectual property rights. The use of Macrovision's copy

protection technology in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless

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64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications

enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS.

Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.

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*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................7

1.1 Terminology .......................................................................................................8

1.2 References .........................................................................................................9

2 Low Power Features ................................................................................................ 11

2.1 Clock Control and Low Power States .................................................................... 11

2.1.1 Core Low-Power States ........................................................................... 12

2.1.2 Package Low-Power States ...................................................................... 13

2.2 Low-Power FSB Features .................................................................................... 15

2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 15

3 Electrical Specifications ........................................................................................... 17

3.1 Power and Ground Pins ...................................................................................... 17

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 17

3.3 Voltage Identification......................................................................................... 17

3.4 Catastrophic Thermal Protection .......................................................................... 20

3.5 Reserved and Unused Pins.................................................................................. 20

3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 21

3.7 FSB Signal Groups............................................................................................. 21

3.8 CMOS Signals ................................................................................................... 23

3.9 Maximum Ratings.............................................................................................. 23

3.10 Processor DC Specifications ................................................................................ 24

4 Package Mechanical Specifications and Pin Information .......................................... 29

4.1 Package Mechanical Specifications ....................................................................... 29

4.2 Processor Pinout and Pin List .............................................................................. 33

4.3 Alphabetical Signals Reference ............................................................................ 53

5 Thermal Specifications and Design Considerations .................................................. 61

5.1 Monitoring Die Temperature ............................................................................... 61

5.1.1 Thermal Diode ....................................................................................... 62

5.1.2 Thermal Diode Offset .............................................................................. 64

5.1.3 Intel® Thermal Monitor........................................................................... 65

5.1.4 Digital Thermal Sensor............................................................................ 66

5.1.5 Out of Specification Detection .................................................................. 67

5.1.6 PROCHOT# Signal Pin ............................................................................. 67

Specyfikacje produktu

Marka:	Intel
Kategoria:	edytor
Model:	T1700
Typ produktu:	Procesor
Typ procesora:	Intel® Celeron® M
Model procesora:	T1700
Kod zharmonizowanego systemu (HS):	8542310001
Producent procesora:	Intel
Liczba rdzeni procesora:	2
Gniazdo procesora:	Gniazdo 478
Maksymalna temperatura eksploatacji:	100 °C
Zautomatyzowany system śledzenia klasyfikacji towarów (CCATS):	NA
Procesor ARK ID:	37119
Technologia Intel® Hyper Threading (Intel® HT Technology):	Nie
Technologia Intel® Turbo Boost:	Nie
Technologia Udoskonalona Intel SpeedStep:	Nie
Technologia Intel® Trusted Execution:	Nie
Intel® 64:	Tak
Technologia virtualizacji Intel® (VT-x):	Nie
Typ pamięci procesora:	L2
Cache procesora:	1 MB
Litografia procesora:	65 nm
Liczba wątków:	2
Tryb pracy procesora:	64-bit
Nazwa kodowa procesora:	Merom
Termiczny układ zasilania (TDP):	35 W
Stepping:	M0
Kod procesora:	SLB6M
Technologia Execute Disable Bit (EDB):	Tak
Wbudowane opcje dostępne:	Nie
Typ magistrali:	FSB
Wielkość opakowania procesora:	35mm x 35mm mm
Karta graficzna on-board:	Nie
Parytet FSB:	Nie
Rozgałęźnik T:	100 °C
Magistrala systemowa:	667 MHz
Seria procesora:	Intel Celeron Processor T1000 Series for Mobile
Intel® Demand Based Switching:	Nie
Współczynnik Magistrala/Rdzeń:	11
Liczba przetwarzających tranzystorów:	291 M
Die Size przetwarzania:	143 mm²
Numer klasyfikacji kontroli eksportu (ECCN):	3A991.A.1
Pudełko:	Nie
Częstotliwość bazowa procesora:	1.83 GHz
Segment rynku:	Mobilny
Zakres napięcia VID:	1.075 - 1.175 V
Prędkość pamięci podręcznej L2:	1.83 GHz
Pamięć cache:	1 MB
Liczba tranzystorów układu graficznego & IMC Die:	291 M
Przepustowość magistrali:	667
Rodzaje magistrali:	MHz
Napięcie rdzenia procesora:	1.075-1.175 V
Nazwa produktu:	Intel Celeron T1700 (1M Cache, 1.83 GHz, 667 MHz FSB)
Status:	Discontinued
Nazwa producenta procesora:	Intel® Celeron®
Rodzina produktów:	Legacy Intel Celeron Processor
Ostatnia zmiana:	63903513
Prędkość magistrala:	667 MHz
Urodzony:	Q4'08
Data premiery:	Q4'08