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Reference Number: 318611 Revision: 001

Quad-Core Intel® Xeon® Processor

5400 Series

Thermal/Mechanical Design Guidelines

November 2007

2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to

deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling1-800-548-4725, or by visiting Intel's website at http://www.intel.com.

Intel, Intel Inside, Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of Intel Corporation or its

subsidiaries in the United States and other countries.

* Other brands and names may be claimed as the property of others.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3

Contents

1 Introduction ..............................................................................................................9

1.1 Objective ...........................................................................................................9

1.2 Scope ................................................................................................................9

1.3 References .........................................................................................................9

1.4 Definition of Terms ............................................................................................ 10

2 Thermal/Mechanical Reference Design.................................................................... 13

2.1 Mechanical Requirements ................................................................................... 13

2.1.1 Processor Mechanical Parameters ............................................................. 13

2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14

2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18

2.2 Processor Thermal Parameters and Features ......................................................... 19

2.2.1 Thermal Control Circuit and TDP............................................................... 19

2.2.2 Digital Thermal Sensor............................................................................ 20

2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21

2.2.4 Multiple Core Special Considerations ......................................................... 21

2.2.5 Thermal Profile ...................................................................................... 24

2.2.6 TCONTROL Definition .............................................................................. 25

2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®

Processor 5400 Series............................................................................. 26

2.2.8 Performance Targets............................................................................... 28

2.3 Fan Fail Guidelines ............................................................................................ 32

2.4 Characterizing Cooling Solution Performance Requirements..................................... 33

2.4.1 Fan Speed Control .................................................................................. 33

2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34

2.4.3 Chassis Thermal Design Considerations ..................................................... 36

2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37

2.5.1 Heatsink Solutions.................................................................................. 37

2.5.2 Thermal Interface Material....................................................................... 38

2.5.3 Summary .............................................................................................. 38

2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39

2.5.5 Thermal Solution Performance Characteristics ............................................ 41

2.5.6 Thermal Profile Adherence....................................................................... 42

2.5.7 Components Overview ............................................................................ 45

2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®

Xeon® Processor 5400 Series Thermal Profile ............................................ 49

A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53

A.1 Component Overview......................................................................................... 53

A.2 Thermal Solution Performance Characterics .......................................................... 54

A.3 Thermal Profile Adherence.................................................................................. 54

B Mechanical Drawings ............................................................................................... 57

C Heatsink Clip Load Methodology .............................................................................. 83

C.1 Overview ......................................................................................................... 83

C.2 Test Preparation................................................................................................ 83

C.2.1 Heatsink Preparation .............................................................................. 83

C.2.2 Typical Test Equipment ........................................................................... 86

C.2.3 Test Procedure Examples ........................................................................ 86

C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86

C.2.5 Preload Degradation under Bake Conditions ............................................... 87

Specyfikacje produktu

Marka:	Intel
Kategoria:	edytor
Model:	E5450
Typ produktu:	Procesor
Przeznaczenie:	Serwer/stacja robocza
Typ procesora:	Intel® Xeon®
Model procesora:	E5450
Kod zharmonizowanego systemu (HS):	8542310001
Producent procesora:	Intel
Liczba rdzeni procesora:	4
Rodzaj opakowania:	Pudełko detaliczne
Gniazdo procesora:	LGA 771 (Socket J)
Maksymalna temperatura eksploatacji:	67 °C
Zautomatyzowany system śledzenia klasyfikacji towarów (CCATS):	NA
Procesor ARK ID:	33083
Technologia Intel® Hyper Threading (Intel® HT Technology):	Nie
Technologia Intel® Turbo Boost:	Nie
Technologia Udoskonalona Intel SpeedStep:	Tak
Technologia Intel® Trusted Execution:	Nie
Intel® Enhanced Halt State:	Tak
Intel® VT-x with Extended Page Tables (EPT):	Nie
Intel® 64:	Tak
Technologia virtualizacji Intel® (VT-x):	Tak
Typ pamięci procesora:	L2
Cache procesora:	12 MB
Litografia procesora:	45 nm
Liczba wątków:	4
Tryb pracy procesora:	64-bit
Nazwa kodowa procesora:	Harpertown
Termiczny układ zasilania (TDP):	80 W
Stepping:	E0
Kod procesora:	SLBBM
Technologia Execute Disable Bit (EDB):	Tak
Stan spoczynku:	Tak
Technologie Thermal Monitoring:	Tak
Wbudowane opcje dostępne:	Nie
Typ magistrali:	FSB
Wielkość opakowania procesora:	37.5 x 37.5 mm
Parytet FSB:	Tak
Tcase:	67 °C
Magistrala systemowa:	1333 MHz
Seria procesora:	Intel Xeon 5400 Series
Intel® Demand Based Switching:	Tak
Współczynnik Magistrala/Rdzeń:	9
Mapa typów obrazów:	<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram" /><img src="https://ark.intel.com/inc/images/diagrams/diagram-6.gif" title="Block Diagram" /></div>
Liczba przetwarzających tranzystorów:	820 M
Die Size przetwarzania:	214 mm²
Numer klasyfikacji kontroli eksportu (ECCN):	3A991.A.1
Typ procesora systemowego:	DP
Pudełko:	Nie
Częstotliwość bazowa procesora:	3 GHz
Segment rynku:	Serwer
Zakres napięcia VID:	0.85 - 1.35 V
Prędkość pamięci podręcznej L2:	3 GHz
Pamięć cache:	12 MB
Liczba tranzystorów układu graficznego & IMC Die:	820 M
Przepustowość magistrali:	1333
Rodzaje magistrali:	MHz
Napięcie rdzenia procesora:	0.850-1.3500 V
Nazwa produktu:	Intel Xeon E5450 (12M Cache, 3.00 GHz, 1333 MHz FSB)
Status:	Discontinued
Nazwa producenta procesora:	Intel® Xeon®
Rodzina produktów:	Intel Xeon Processor 5000 Sequence
Ostatnia zmiana:	63903513
Prędkość magistrala:	1333 MHz
Urodzony:	Q4'07
Data premiery:	Q4'07