Instrukcja obsługi Intel DCP3600

Intel dysk półprzewodnikowy (SSD) DCP3600

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Order Number: 330569-002 US

Intel® Solid-State Drive DC P3600 Series

Product Specification

 Capacities:

 400GB 800GB, 1.2TB, 1 TB, 2TB , .6

PCIe* Gen3 X4

Form Factors

– 2.5-inch Form Factor

 15mm Z-height

 8639-compatible connector

– AIC Form Factor

 Half-height, Half-length

 Single slot p1-x4 connector

Performance1,2

– Seq R/W: Up to 26 1700MB/s00/ 3

– IOPS Rnd 70/30 R/W 4KB4: Up to 160K

– IOPS Rnd 4KB4 R/W: Up to 450/ K 56

– Seq Latency (typ) R/W: 20/20µs

Components

– Intel® 20nm MLC NAND Flash Memory

Operating System Support:

– Windows* Server 2012 R2 , , 2012

2008 R2 x64

– RHEL* 6.5, 7.0

– UEFI 2.3.1

Reliability

– Uncorrectable Bit Error Rate (UBER):

1 sector per 1017 bits read

– Mean Time Before Failure (MTBF):

2 million hours

– T10 DIF protection

– Variable Sector Size: 512, 520, 528,

4096, 4104, 4160, 4224 Bytes

Powe r

– 2.5-inch: 3.3V and 12V Supply Rail

– AIC: 3.3V and 12V Supply Rail

– Enhanced power-loss data protection

– Active/Idle (TYP): Up to 25W/4W (TYP)

Compliance

– NVM Express* 1.0

– PCI Express Base Specification Rev 3.0

– Enterprise SSD Form Factor Version 1.0a

– PCI Express Card Electro-Mechanical

( ) Specification Rev 2.0 CEM

Certifications and Declarations

– UL*, CE*, C-Tick*, BSMI*, KCC*,

Microsoft WHQL*, VCCI *

En rance Rating du

– Up to 10.95 PBW (Petabytes Written)5

3 Drive Writes/day (JESD219 workload)

Temperature Specification

– Operating:

 AIC: 0 to 55° C with specified airflow

 2.5-inch: 0 to 35° C ambient,

0 to 70° C case with specified airflow

– Non-Operating6: -55 to 95° C

– Temperature monitoring (In-band and by

way of SMBUS)

– Thermal throttling

Airflow

– AIC (55° C airflow towards IO bracket7)

 400 GB: 100 LFM

 800GB/1.2TB/ 6TB/2.0TB: 300 LFM 1.

– 2.5-inch (Airflow towards the connector)

 400 50/GB: 2 300 LFM (25/35° C)

 800GB: 350/500 LFM (25/35° C)

 1.2TB/ 6 /2.0TB 1. TB :

450/650 LFM (25/35° C)

Weight

 AIC: 400/800GB up to 185gm

1.2TB, 1.6TB, 2TB up to 195gm

 2.5-inch: 400/800GB up to 115 gm

1.2TB, 1.6TB, 2TB up to 125gm

Shock

– 2.5-inch: 1,000 G/0.5msec

– AIC: 50 G Trapezoidal, 170 in/s

Vibration

– Operating: 2. G17 RMS (5-700Hz)

– Non-Operating: 3.13 GRMS -800Hz) (5

Altitude (Simulated)

– Operating -1,000 to 10,000 ft :

– Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

– RoHS

1. Performan value vary by capacity and form factorce s

2. Performance specifications apply to both compressible and incompressible data

3. MB/s = 1,000,000 bytes/second

4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes

5. 1PB = 1015 Bytes

6. Please contact your Intel representative for details on the non-operating temperature range

7. Airflow out of server through PCIe Card Slot

Product Specification 2014 July

2 330569-002 US

Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CON-DITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS

INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR

INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1- - -4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel 800 548

Corporation in the U.S. and other countries.

Intel® Solid-State Drive DC P3600 Series

July 2014 Product Specification

330569-002 3 US

Contents

1 Overview ..................................................................................................................... 7

1.1 References ................................................................................................................... 8

1.2 Terms and Acronyms ..................................................................................................... 9

2 Product Specifications ...................................................................................................10

2.1 Capacity ..................................................................................................................... 10

2.2 Performance ................................................................................................................ 10

2.3 Electrical Characteristics ............................................................................................... 12

2.4 Environmental Conditions ............................................................................................. 13

2.5 Product Regulatory Compliance .....................................................................................15

2.6 Reliability Specifications ................................................................................................ 16

2.7 Temperature Sensor ..................................................................................................... 16

2.8 Power Loss Capacitor Test ............................................................................................. 16

2.9 Hot Plug Support ......................................................................................................... 17

2.10 Out of Band Management (SMBUS) ................................................................................ 17

2.11 Variable Sector Size Support ......................................................................................... 17

3 Mechanical Information ................................................................................................18

4 Pin and Signal Descriptions ........................................................................................... 20

4.1 2.5-inch Form Factor Pin Locations ................................................................................. 20

4.2 Pin Signal Definitions .................................................................................................... 20

5 Supported Command Sets ............................................................................................23

5.1 NVMe* Admin Command Set ......................................................................................... 23

5.2 NVMe* I/O Command Set ............................................................................................. 23

5.3 Log Page Support ........................................................................................................24

5.4 SMART Attributes ......................................................................................................... 24

5.5 Temperature Statistics . ................................................................................................ 27

5.6 Drive Marketing Name Log ............................................................................................ 27

5.7 SET Feature Identifiers ................................................................................................. 27

6 NVMe* Driver Support .................................................................................................. 29

7 Certifications and Declarations ....................................................................................... 30

Appendix A IDENTIFY Data Structure ................................................................................. 31

Appendix B Vital Data Structure ........................................................................................38

Appendix C Out of Band Temperature Sensor Read Out ........................................................39

Appendix D PCIe* ID ........................................................................................................ 40

Appendix E SCSI Command Translati on .............................................................................. 41

Appendix F Add-in Card LED Decoder ................................................................................. 42

Specyfikacje produktu

Marka:	Intel
Kategoria:	dysk półprzewodnikowy (SSD)
Model:	DCP3600
Kolor produktu:	Szary
Wysokość produktu:	- mm
Szerokość produktu:	- mm
Głębokość produktu:	- mm
Waga produktu:	195 g
Certyfikat środowiskowy (zrównoważonego rozwoju):	RoHS
Certyfikaty:	UL, CE, C-Tick, BSMI, KCC, Microsoft WHQL, VCCI
Wewnętrzny:	Tak
Zakres temperatur (eksploatacja):	0 - 55 °C
Wi-Fi:	Nie
Zakres temperatur (przechowywanie):	-55 - 95 °C
Pojemność dysku:	1600 GB
Standardowe rozwiązania komunikacyjne:	PCI Express 3.0
MTBF (Średni okres międzyawaryjny):	2000000 h
Rozmiar kieszeni dysku SSD:	Half-Height/Half-Length (HH/HL)
Maksymalna wysokość eksploatacji:	3048 m
Litografia procesora:	20 nm
Pojemność pamięci SSD:	1600 GB
Prędkość odczytu z nośnika:	2600 MB/s
UBER:	< 1 per 10^17 bits read
Typ pamięci:	MLC
NVMe:	Tak
Prędkość zapisu nośnika:	1600 MB/s
Litografia:	20 nm
Łącze PCI Express:	x4
Losowy odczyt (4KB):	450000 IOPS
Losowy zapis (4KB):	56000 IOPS
Wstrząsy podczas pracy:	50 G
Segment rynku:	Serwer
Wibracje podczas pracy:	2.17 G
Wibracje podczas przechowywania:	3.13 G
Pobór mocy (bezczynny):	4 W
Opóźnienie zapisu:	20 µs
Losowy odczyt (8 KB):	270000 IOPS
Zapis losowy (8 KB):	33000 IOPS
Opóźnienie odczytu:	20 µs
Technologia Enhanced Power Loss Data Protection:	Tak
Monitoring temperatury SSD:	Tak
Ochrona danych End-to-End Data Protection:	Tak
Random write (100% span):	56000 IOPS
Nazwa produktu:	Intel SSD DC P3600 Series (1.6TB, 1/2 Height PCIe 3.0, 20nm, MLC)
Status:	Discontinued
Rodzina produktów:	Centrum danych SSD
Ostatnia zmiana:	63903513
Rewizja PCI Express CEM:	2.0
Urodzony:	Q2'14
Data premiery:	Q2'14
SSD ARK ID:	80992
Seria produktów:	Intel DC P3600
Nazwa kodowa produktu:	Fultondale
Odczyt sekwencyjny:	2600 MB/s
Szybkość zapise sekwencyjnego:	1600 MB/s
Zużycie prądu dysku SSD (tryb pracy):	20W (write), 9W (read)
Zużycie prądu dysku SSD (tryb bezczynności):	4W
Dysk SSD - wstrząsy:	50 G Trapezoidal, 170 in/s
SSD jest przeznaczona do:	Centrum danych
Intel® High Endurance Technology (HET):	Tak
URL do instrukcji:	http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf
Wytrzymałość dysku SSD:	8.76 PBW (JEDEC Workload)
Waga dysku SSD:	195gm g
Maksymalna wysokość nie operowania:	12192 m