Instrukcja obsługi Intel Core 2 Quad Q6700

Intel edytor Core 2 Quad Q6700

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Document Number: 315592-005

Intel® Core™2 Extreme Quad-Core

Processor QX6000Δ Sequence and

Intel® Core™2 Quad Processor

Q6000Δ Sequence

Datasheet

—on 65 nm Process in the 775-land LGA Package supporting

Intel® 64 architecture and Intel® Virtualization Technology±

August 2007

2 Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel

® Core™2 quad processor Q6000 sequence may contain design defects or

errors known as errata which may cause the product to deviate from published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor

will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software

configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or

consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel® Virtualization Technology requires a computer system with an enabled Intel

® processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Intel, Pentium, Itanium, Xeon, Intel SpeedStep, andand the Intel logo are trademarks of Intel Corporation in the U.S. and other countries..

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................9

1.1 Terminology .......................................................................................................9

1.1.1 Processor Terminology ............................................................................ 10

1.2 References ....................................................................................................... 11

2 Electrical Specifications ........................................................................................... 13

2.1 Power and Ground Lands.................................................................................... 13

2.2 Decoupling Guidelines........................................................................................ 13

2.2.1 VCC Decoupling ..................................................................................... 13

2.2.2 VTT Decoupling...................................................................................... 13

2.2.3 FSB Decoupling...................................................................................... 14

2.3 Voltage Identification......................................................................................... 14

2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16

2.5 Voltage and Current Specification ........................................................................ 17

2.5.1 Absolute Maximum and Minimum Ratings .................................................. 17

2.5.2 DC Voltage and Current Specification ........................................................ 18

2.5.3 VCC Overshoot ...................................................................................... 21

2.5.4 Die Voltage Validation............................................................................. 21

2.6 Signaling Specifications...................................................................................... 22

2.6.1 FSB Signal Groups.................................................................................. 22

2.6.2 CMOS and Open Drain Signals ................................................................. 24

2.6.3 Processor DC Specifications ..................................................................... 24

2.6.3.1 GTL+ Front Side Bus Specifications ............................................. 26

2.7 Clock Specifications ........................................................................................... 26

2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 26

2.7.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 27

2.7.3 Phase Lock Loop (PLL) and Filter .............................................................. 27

2.7.4 BCLK[1:0] Specifications ......................................................................... 28

3 Package Mechanical Specifications .......................................................................... 31

3.1 Package Mechanical Drawing............................................................................... 31

3.2 Processor Component Keep-Out Zones................................................................. 35

3.3 Package Loading Specifications ........................................................................... 35

3.4 Package Handling Guidelines............................................................................... 35

3.5 Package Insertion Specifications.......................................................................... 36

3.6 Processor Mass Specification............................................................................... 36

3.7 Processor Materials............................................................................................ 36

3.8 Processor Markings............................................................................................ 36

3.9 Processor Land Coordinates ................................................................................ 38

4 Land Listing and Signal Descriptions ....................................................................... 39

4.1 Processor Land Assignments ............................................................................... 39

4.2 Alphabetical Signals Reference ............................................................................ 62

5 Thermal Specifications and Design Considerations .................................................. 71

5.1 Processor Thermal Specifications ......................................................................... 71

5.1.1 Thermal Specifications ............................................................................ 71

5.1.2 Thermal Metrology ................................................................................. 76

5.2 Processor Thermal Features................................................................................ 76

5.2.1 Thermal Monitor..................................................................................... 76

5.2.2 Thermal Monitor 2.................................................................................. 77

5.2.3 On-Demand Mode .................................................................................. 78

5.2.4 PROCHOT# Signal .................................................................................. 79

Specyfikacje produktu

Marka:	Intel
Kategoria:	edytor
Model:	Core 2 Quad Q6700
Typ produktu:	Procesor
Typ procesora:	Intel® Core™2 Quad
Model procesora:	Q6700
Kod zharmonizowanego systemu (HS):	8542310001
Producent procesora:	Intel
Liczba rdzeni procesora:	4
Rodzaj opakowania:	Pudełko detaliczne
Gniazdo procesora:	LGA 775 (Socket T)
Maksymalna temperatura eksploatacji:	62.2 °C
Zautomatyzowany system śledzenia klasyfikacji towarów (CCATS):	NA
Procesor ARK ID:	30790
Technologia Intel® Hyper Threading (Intel® HT Technology):	Nie
Technologia Intel® Turbo Boost:	Nie
Nowe instrukcje AES (Intel® AES-NI):	Nie
Technologia Udoskonalona Intel SpeedStep:	Tak
Technologia Intel® Trusted Execution:	Nie
Intel® Enhanced Halt State:	Tak
Intel® 64:	Tak
Technologia virtualizacji Intel® (VT-x):	Tak
Typ pamięci procesora:	L2
Cache procesora:	8 MB
Litografia procesora:	65 nm
Liczba wątków:	4
Tryb pracy procesora:	64-bit
Termiczny układ zasilania (TDP):	105 W
Stepping:	G0
Kod procesora:	SLACQ
Technologia Execute Disable Bit (EDB):	Tak
Stan spoczynku:	Tak
Technologie Thermal Monitoring:	Tak
Wbudowane opcje dostępne:	Nie
Typ magistrali:	FSB
Wielkość opakowania procesora:	37.5 x 37.5 mm
Parytet FSB:	Nie
Tcase:	62.2 °C
Magistrala systemowa:	1066 MHz
Intel® Demand Based Switching:	Nie
Współczynnik Magistrala/Rdzeń:	10
Liczba przetwarzających tranzystorów:	582 M
Die Size przetwarzania:	286 mm²
Numer klasyfikacji kontroli eksportu (ECCN):	3A991.A.1
Pudełko:	Tak
Częstotliwość bazowa procesora:	2.66 GHz
Segment rynku:	Komputer stacjonarny
Zakres napięcia VID:	0.85 - 1.5 V
Prędkość pamięci podręcznej L2:	2.66 GHz
Przepustowość magistrali:	1066
Rodzaje magistrali:	MHz
Status:	Discontinued
Nazwa producenta procesora:	Intel® Core™2 Quad
Rodzina produktów:	Intel Core Processors
Ostatnia zmiana:	63903513
Prędkość magistrala:	1066 MHz
Data premiery:	Q3'07