Instrukcja obsługi Intel 2860QM

Intel Processor 2860QM

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Document Number: 320835-003

Intel® Core™ i7-900 Desktop

Processor Extreme Edition Series

and Intel® Core™ i7-900 Desktop

Processor Series

Datasheet, Volume 2

October 2009

2 Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Intel® Core™ i7-900 desktop processor Extreme Edition series and Intel ® Core™ i7-900 desktop processor series may contain

design defects or errors known as errata which may cause the product to deviate from published specifications. Current

characterized errata are available on request.

ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time

processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not

intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number

progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-

enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For

more information including details on which processors support HT Technology, see

http://www.intel.com/products/ht/hyperthreading_more.htm

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled

for Intel® 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary

depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details on

which processors support Intel® 64 or consult with your system vendor for more information.

± Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and

for some uses, certain platform software, enabled for it. Functionality, performance or other benefit will vary depending on

hardware and software configurations. Intel Virtualization Technology-enabled VMM applications are currently in development.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting

operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Enhanced Intel® SpeedStep Technology. See the Processor Spec Finder or contact your Intel representative for more information.

Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

Technology performance varies depending on hardware, software and overall system configuration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com .

Intel, Xeon, Enhanced Intel SpeedStep Technology and the Intel logo are trademarks of Intel Corporation in the United States and

other countries.

*Other brands and names are the property of their respective owners.

Datasheet 3

Contents

1 Introduction ............................................................................................................ 11

1.1 Terminology ..................................................................................................... 11

1.1.1 Processor Terminology .......................................................................... 11

1.2 References ....................................................................................................... 13

2 Register Description ................................................................................................ 15

2.1 Register Terminology ......................................................................................... 15

2.2 Platform Configuration Structure ......................................................................... 16

2.3 Device Mapping................................................................................................. 17

2.4 Detailed Configuration Space Maps ...................................................................... 18

2.5 PCI Standard Registers ...................................................................................... 36

2.5.1 VID - Vendor Identification Register ........................................................ 36

2.5.2 DID - Device Identification Register......................................................... 36

2.5.3 RID - Revision Identification Register....................................................... 37

2.5.4 CCR - Class Code Register ..................................................................... 37

2.5.5 HDR - Header Type Register................................................................... 38

2.5.6 SID/SVID - Subsystem Identity/Subsystem Vendor

Identification Register ........................................................................... 38

2.5.7 PCICMD - Command Register ................................................................. 39

2.5.8 PCISTS - PCI Status Register.................................................................. 40

2.6 SAD - System Address Decoder Registers ............................................................. 41

2.6.1 SAD_PAM0123 ..................................................................................... 41

2.6.2 SAD_PAM456 ....................................................................................... 43

2.6.3 SAD_HEN ............................................................................................ 44

2.6.4 SAD_SMRAM ........................................................................................ 44

2.6.5 SAD_PCIEXBAR .................................................................................... 45

2.6.6 SAD_DRAM_RULE_0, SAD_DRAM_RULE_1, SAD_DRAM_RULE_2,

SAD_DRAM_RULE_3

SAD_DRAM_RULE_4, SAD_DRAM_RULE_5

SAD_DRAM_RULE_6, SAD_DRAM_RULE_7 ............................................... 45

2.6.7 SAD_INTERLEAVE_LIST_0, SAD_INTERLEAVE_LIST_1

SAD_INTERLEAVE_LIST_2, SAD_INTERLEAVE_LIST_3

SAD_INTERLEAVE_LIST_4, SAD_INTERLEAVE_LIST_5

SAD_INTERLEAVE_LIST_6, SAD_INTERLEAVE_LIST_7 ............................... 46

2.7 Intel QPI Link Registers...................................................................................... 47

2.7.1 QPI_QPILCL_L0, QPI_QPILCL_L1 ............................................................ 47

2.8 Integrated Memory Controller Control Registers .................................................... 47

2.8.1 MC_CONTROL ...................................................................................... 47

2.8.2 MC_STATUS......................................................................................... 49

2.8.3 MC_SMI_SPARE_DIMM_ERROR_STATUS.................................................. 50

2.8.4 MC_SMI_SPARE_CNTRL......................................................................... 51

2.8.5 MC_RESET_CONTROL............................................................................ 51

2.8.6 MC_CHANNEL_MAPPER.......................................................................... 52

2.8.7 MC_MAX_DOD...................................................................................... 53

2.8.8 MC_RD_CRDT_INIT............................................................................... 54

2.8.9 MC_CRDT_WR_THLD............................................................................. 55

2.8.10 MC_SCRUBADDR_LO............................................................................. 55

2.8.11 MC_SCRUBADDR_HI ............................................................................. 56

2.9 TAD – Target Address Decoder Registers .............................................................. 57

2.9.1 TAD_DRAM_RULE_0, TAD_DRAM_RULE_1

TAD_DRAM_RULE_2, TAD_DRAM_RULE_3

TAD_DRAM_RULE_4, TAD_DRAM_RULE_5

TAD_DRAM_RULE_6, TAD_DRAM_RULE_7................................................ 57

Specyfikacje produktu

Marka:	Intel
Kategoria:	Processor
Model:	2860QM
Typ produktu:	Procesor
Szerokość opakowania:	44 mm
Wysokość opakowania:	117 mm
Głębokość opakowania:	140 mm
Typ procesora:	Intel® Core™ i7
Model procesora:	i7-2860QM
Kod zharmonizowanego systemu (HS):	8542310001
Waga wraz z opakowaniem:	74 g
Producent procesora:	Intel
Liczba rdzeni procesora:	4
Obsługiwane rodzaje pamięci:	DDR3-SDRAM
Maksymalna pojemność pamięci:	32 GB
Obsługa kanałów pamięci:	Dwukanałowy
Gniazdo procesora:	BGA 1224
Maksymalna temperatura eksploatacji:	100 °C
Korekcja ECC:	Nie
Maksymalna pamięć wewnętrzna:	32768 MB
Zautomatyzowany system śledzenia klasyfikacji towarów (CCATS):	G077159
Procesor ARK ID:	53476
Technologia Intel® Hyper Threading (Intel® HT Technology):	Tak
Technologia Intel® Turbo Boost:	2.0
Technologia Intel® Quick Sync Video:	Tak
Technologia Intel® InTru™ 3D:	Tak
Technologia Intel® Clear Video HD (Intel® CVT HD):	Tak
Nowe instrukcje AES (Intel® AES-NI):	Tak
Technologia Udoskonalona Intel SpeedStep:	Tak
Technologia Intel® Trusted Execution:	Tak
Maksymalna konfiguracja CPU:	1
Intel® Enhanced Halt State:	Tak
Intel® VT-x with Extended Page Tables (EPT):	Tak
Intel® 64:	Tak
Technologia Wirtualizacji Intel® (Directed I/O) (VT-d):	Tak
Technologia virtualizacji Intel® (VT-x):	Tak
Typ pamięci procesora:	Smart Cache
Cache procesora:	8 MB
Wskaźnik magistrali systemowej:	5 GT/s
Maksymalne taktowanie procesora:	3.6 GHz
Litografia procesora:	32 nm
Liczba wątków:	8
Tryb pracy procesora:	64-bit
Nazwa kodowa procesora:	Sandy Bridge
Maksymalna pamięć wewnętrzna wspierana przez procesor:	32 GB
Typy pamięci wspierane przez procesor:	DDR3-SDRAM
Taktowanie zegara pamięci wspierane przez procesor:	1066,1333,1600 MHz
Przepustowość pamięci obsługiwana przez procesor ( max ):	25.6 GB/s
Maksymalna liczba linii PCI Express:	16
Konfiguracje PCI Express:	1x16, 2x8, 1x8, 2x4
Termiczny układ zasilania (TDP):	45 W
Bezkonfliktowy procesor:	Nie
Stepping:	D2
Instrukcje obsługiwania:	AVX
Technologia Execute Disable Bit (EDB):	Tak
Stan spoczynku:	Tak
Technologie Thermal Monitoring:	Tak
Wbudowane opcje dostępne:	Nie
Typ magistrali:	DMI
Wielkość opakowania procesora:	37.5mm x 37.5mm; 31mm x 24mm mm
Karta graficzna on-board:	Tak
Model karty graficznej on-board:	Intel® HD Graphics 3000
Wersja gniazd typu Slot (PCI Express):	2.0
Rozgałęźnik T:	100 °C
Magistrala systemowa:	- MHz
Seria procesora:	Intel Core i7-2800 Mobile Series
Generowanie procesora:	Intel® Core™ i7 drugiej generacji
Wbudowana bazowa częstotliwość procesora:	650 MHz
Dynamiczne taktowanie wbudowanej karty graficznej (max):	1300 MHz
Liczba monitorów wspieranych (wbudowana karta graficzna):	2
ID wbudowanego urządzenia graficznego:	0x116
Intel® Wireless Display (Intel® WiDi):	Tak
Technologia Intel® My WiFi (Intel® MWT):	Tak
Technologia Intel® Identity Protection (Intel® IPT):	Tak
Technologia Intel® Anti-Theft (Intel® AT):	Tak
Intel® Insider™:	Tak
Technologia Intel® FDI:	Tak
Intel® Flex Memory Access:	Tak
Intel® Fast Memory Access:	Tak
Intel® Demand Based Switching:	Nie
Układ graficzny i litografia IMC:	32 nm
Technologia Intel® Dual Display Capable:	Tak
Wersja technologii Intel® Identity Protection:	1.00
Współczynnik Magistrala/Rdzeń:	25
Zintegrowany 4G WiMAX:	Tak
Mapa typów obrazów:	<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-18.gif" title="Block Diagram" /></div>
Numer klasyfikacji kontroli eksportu (ECCN):	5A992C
Kwalifikowalność platformy Intel® vPro ™:	Tak
Pudełko:	Nie
Częstotliwość bazowa procesora:	2.5 GHz
Segment rynku:	Mobilny
Przepustowość magistrali:	5
Rodzaje magistrali:	GT/s
Status:	Discontinued
Nazwa producenta procesora:	Intel Core i7\nIntel Core i7 Processor
Rodzina produktów:	2nd Generation Intel Core i7 Processors
Ostatnia zmiana:	63903513
Prędkość magistrala:	5 GT/s
Rewizja PCI Express CEM:	2.0
Data premiery:	Q4'11
Grafika:	eDP/DP/HDMI/SDVO/CRT
Wymagana licencja Macrovision:	Nie
Generacja:	2nd Generation
Częstotliwość technologii Intel® Turbo Boost 2.0:	3.6 GHz
ID procesora:	0x116