Instrukcja obsługi HP Intel Xeon W3550

HP edytor Intel Xeon W3550

Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla HP Intel Xeon W3550 (72 stron) w kategorii edytor. Ta instrukcja była pomocna dla 7 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek

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Document Number: 321461-001
Intel® Xeon® Processor 3500 Series
Thermal / Mechanical Design Guide
March 2009
2 Thermal and Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® Processor 3500 Series and LGA1366 socket may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, the Intel logo, Intel, Pentium, Core and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009, Intel Corporation.
Thermal and Mechanical Design Guide 3
Contents
1 Introduction ..............................................................................................................7
1.1 References .........................................................................................................8
1.2 Definition of Terms ..............................................................................................8
2 LGA1366 Socket ...................................................................................................... 11
2.1 Board Layout .................................................................................................... 13
2.2 Attachment to Motherboard ................................................................................ 14
2.3 Socket Components........................................................................................... 14
2.3.1 Socket Body Housing .............................................................................. 14
2.3.2 Solder Balls ........................................................................................... 14
2.3.3 Contacts ............................................................................................... 15
2.3.4 Pick and Place Cover............................................................................... 15
2.4 Package Installation / Removal ........................................................................... 16
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 16
2.5 Durability ......................................................................................................... 17
2.6 Markings .......................................................................................................... 17
2.7 Component Insertion Forces ............................................................................... 17
2.8 Socket Size ...................................................................................................... 17
2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 18
3 Independent Loading Mechanism (ILM)................................................................... 19
3.1 Design Concept................................................................................................. 19
3.1.1 ILM Cover Assembly Design Overview ....................................................... 19
3.1.2 ILM Back Plate Design Overview............................................................... 20
3.2 Assembly of ILM to a Motherboard....................................................................... 20
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 23
4.1 Component Mass............................................................................................... 23
4.2 Package/Socket Stackup Height .......................................................................... 23
4.3 Socket Maximum Temperature............................................................................23
4.4 Loading Specifications........................................................................................ 24
4.5 Electrical Requirements...................................................................................... 24
4.6 Environmental Requirements .............................................................................. 25
5 Sensor Based Thermal Specification Design Guidance.............................................. 27
5.1 Sensor Based Specification Overview ................................................................... 27
5.2 Sensor Based Thermal Specification..................................................................... 28
5.2.1 TTV Thermal Profile ................................................................................ 28
5.2.2 Specification When DTS value is Greater than TCONTROL ............................ 29
5.3 Thermal Solution Design Process .........................................................................30
5.3.1 Boundary Condition Definition ..................................................................30
5.3.2 Thermal Design and Modelling.................................................................. 31
5.3.3 Thermal Solution Validation ..................................................................... 32
5.4 Fan Speed Control (FSC) Design Process .............................................................. 33
5.4.1 Fan Speed Control Algorithm without TAMBIENT Data ................................. 34
5.4.2 Fan Speed Control Algorithm with TAMBIENT Data...................................... 35
5.5 System Validation ............................................................................................. 36
5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL........... 37
6 ATX Reference Thermal Solution.............................................................................. 39
6.1 Operating Environment ...................................................................................... 39
6.2 Heatsink Thermal Solution Assembly.................................................................... 40
6.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical Design ........... 41
6.4 Reference Design Components............................................................................ 42

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Marka: HP
Kategoria: edytor
Model: Intel Xeon W3550

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