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Document Number: 313079-001

Dual-Core Intel® Xeon®

Processor 5000 Series

Datasheet

May 2006

2 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

INFORMATION IN THIS DOCUMENT

IS PROVIDED IN CONNE

CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising fro

m future

changes to them.

The Dual-Core Intel® Xeon® Processor 5000 Series may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Xeon, Intel SpeedStep, Intel NetBurst, Intel Architecture, Intel Virtualization Technology, and the Intel logo

are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 3

Contents

1 Introduction.................................................................................................................9

1.1 Terminology ..................................................................................................... 11

1.2 State of Data .................................................................................................... 12

1.3 References ....................................................................................................... 12

2 Electrical Specifications ............................................................................................... 15

2.1 Front Side Bus and GTLREF ................................................................................ 15

2.2 Power and Ground Lands.................................................................................... 15

2.3 Decoupling Guidelines........................................................................................ 16

2.3.1 VCC Decoupling...................................................................................... 16

2.3.2 VTT Decoupling ...................................................................................... 16

2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16

2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16

2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17

2.4.2 Phase Lock Loop (PLL) and Filter .............................................................. 18

2.5 Voltage Identification (VID) ................................................................................ 19

2.6 Reserved or Unused Signals................................................................................ 21

2.7 Front Side Bus Signal Groups.............................................................................. 21

2.8 GTL+ Asynchronous and AGTL+ Asynchronous Signals........................................... 23

2.9 Test Access Port (TAP) Connection....................................................................... 23

2.10 Mixing Processors.............................................................................................. 24

2.11 Absolute Maximum and Minimum Ratings ............................................................. 24

2.12 Processor DC Specifications ................................................................................ 25

2.12.1 VCC Overshoot Specification .................................................................... 31

2.12.2 Die Voltage Validation ............................................................................. 32

3 Mechanical Specifications............................................................................................. 33

3.1 Package Mechanical Drawings ............................................................................. 33

3.2 Processor Component Keepout Zones................................................................... 37

3.3 Package Loading Specifications ........................................................................... 37

3.4 Package Handling Guidelines............................................................................... 38

3.5 Package Insertion Specifications.......................................................................... 38

3.6 Processor Mass Specifications ............................................................................. 38

3.7 Processor Materials............................................................................................ 38

3.8 Processor Markings............................................................................................ 39

3.9 Processor Land Coordinates ................................................................................ 40

4 Land Listing ............................................................................................................... 43

4.1 Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43

4.1.1 Land Listing by Land Name...................................................................... 43

4.1.2 Land Listing by Land Number................................................................... 52

5 Signal Definitions ...................................................................................................... 61

5.1 Signal Definitions .............................................................................................. 61

6 Thermal Specifications ................................................................................................ 69

6.1 Package Thermal Specifications ........................................................................... 69

6.1.1 Thermal Specifications ............................................................................ 69

6.1.2 Thermal Metrology ................................................................................. 75

6.2 Processor Thermal Features................................................................................ 77

6.2.1 Thermal Monitor..................................................................................... 77

6.2.2 On-Demand Mode .................................................................................. 77

6.2.3 PROCHOT# Signal .................................................................................. 78

6.2.4 FORCEPR# Signal................................................................................... 78

6.2.5 THERMTRIP# Signal ............................................................................... 78

Specyfikacje produktu

Marka:	Fujitsu
Kategoria:	edytor
Model:	Intel Xeon 5080
Przeznaczenie:	Serwer/stacja robocza
Typ procesora:	Intel® Xeon®
Model procesora:	5080
Liczba rdzeni procesora:	2
Gniazdo procesora:	LGA 771 (Socket J)
Maksymalna temperatura eksploatacji:	78 °C
Typ pamięci procesora:	L2
Cache procesora:	4 MB
Litografia procesora:	65 nm
Tryb pracy procesora:	64-bit
Termiczny układ zasilania (TDP):	130 W
Magistrala systemowa:	1066 MHz
Współczynnik Magistrala/Rdzeń:	14
Typ procesora systemowego:	DP
Pudełko:	Nie
Częstotliwość bazowa procesora:	3.73 GHz
Segment rynku:	Serwer
Zakres napięcia VID:	1.075 - 1.35 V
Prędkość pamięci podręcznej L2:	3.73 GHz