Instrukcja obsługi Delkin Devices CFexpress
Delkin Devices
Błyskawice
CFexpress
Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Delkin Devices CFexpress (25 stron) w kategorii Błyskawice. Ta instrukcja była pomocna dla 5 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek
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CFexpress - -401 0457 00 Rev. A
© 1 2019 | Delkin Devices Inc.
CFexpress
Engineering Specification
Document Number: 401-0457- 00
Revision: A
CFexpress - -401 0457 00 Rev. A
© 2 2019 | Delkin Devices Inc.
Product Overview
Capacities
■ 128, 256, 512 GB
Form Factor
■ CFexpress Type B
PCIe Interface
■ NVMe PCIe Gen 3 x 2
Compliance
■ NVMe 1.3
■ PCI Express Base 3.1
Performance1
■ Read: up to 1600 MB/s
■ Write: up to 1000MB/s
Reliability
■ Mean Time Between Failure (MTBF)
More than TBD hours
■ Uncorrectable Bit Error Rate (UBER) < 1
sector per 1016 bits read
Advanced Flash Management
■ Static and Dynamic Wear Leveling
■ Bad Block Management
■ TRIM
■ SMART
■ Over-Provisioning
■ Firmware Update Capability
Power Management
■ Support APST
■ Support ASPM
■ Support L1.2
Power Consumption2
■ Idle < 50 mW
■ L1.2 < 2 mW
Temperature Range
■ Operation: - 40°C to 85°C
■ Storage: - 40°C to 85°C
RoHS-Compliant
Features Support List:
■ End to end data path protection
■ Thermal throttling
■ SmartECCTM
■ SmartRefreshTM
■ Drive log
■ Support of TCG OPAL3
■ Support of TCG Pyrite4
N : OTES
1. Refer to Chapter 2 Section 1.1 for more details
2. Refer to Chapter 4, Section 4.2 Power Consumption for more details.
3. Supported by a separate firmware version. Further information available upon request.
4. Supported by a separate firmware version. Further information available upon request.
CFexpress - -401 0457 00 Rev. A
© 3 2019 | Delkin Devices Inc.
TABLE OF CONTENTS
1. INTRODUCTION ............................................................................................................... 5
1.1. General Description ........................................................................................................... 5
1.2. Product Block Diagram 5......................................................................................................
1.3. Flash Management ............................................................................................................ 5
1.3.1. Error Correction Code (ECC) .................................................................................... 5
1.3.2. Wear Leveling 5.........................................................................................................
1.3.3. Bad Block Management .......................................................................................... 6
1.3.4. TRIM ........................................................................................................................ 6
1.3.5. SMART ..................................................................................................................... 6
1.3.6. Over-Provisioning .................................................................................................... 7
1.3.7. Firmware Upgrade .................................................................................................. 7
1.3.8. Thermal Throttling .................................................................................................. 7
1.4. GuaranteedFlushTM ............................................................................................................ 7
1.5. Advanced Device Security Features ................................................................................... 7
1.5.1. Secure Erase ............................................................................................................ 7
1.5.2. Crypto Erase ............................................................................................................ 8
1.5.3. Physical Presence SID (PSID) ................................................................................... 8
1.6. SSD Lifetime Management 8................................................................................................
1.6.1. Terabytes Written (TBW) ......................................................................................... 8
1.6.2. Media Wear Indicator ............................................................................................. 8
1.6.3. Read Only Mode (End of Life) 9.................................................................................
1.7. Adaptive Approach to Performance Tuning 9......................................................................
1.7.1. Throughput ............................................................................................................. 9
1.7.2. Predict & Fetch ........................................................................................................ 9
1.7.3. SLC Caching ............................................................................................................. 9
2. PRODUCT SPECIFICATIONS ............................................................................................ 10
3. ENVIRONMENTAL SPECIFICATIONS ................................................................................ 12
3.1. Environmental Conditions ...............................................................................................12
3.1.1. Temperature and Humidity ................................................................................... 12
3.1.2. Shock ..................................................................................................................... 13
3.1.3. Vibration ............................................................................................................... 13
3.1.4. Drop ......................................................................................................................13
Specyfikacje produktu
Marka: | Delkin Devices |
Kategoria: | Błyskawice |
Model: | CFexpress |
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