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User Manual
MIO-2364
Intel® Core™ i3-N305 Processor,
Intel® N-Series Processor, and
Intel® Atom™ x7000E Series
Processor
2.5" Pico-ITX SBC
(Code name: Alder Lake N)
MIO-2364 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2024
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. The information provided in this manual is intended to be accurate and reliable.
However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any
infringements of the rights of third parties that may result from its use.
Acknowledgments
Intel® is a trademark of Intel® Corporation.
AMI is a trademark of American Megatrends, Inc.
IBM, PC, PS/2, and VGA are trademarks of International Business Machines Corpo-
ration.
Microsoft Windows® and DirectX® are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
For more information on this and other Advantech products, please visit our websites
at:
http://www.advantech.com
http://www.advantech.com/eplatform
For technical support and service, please visit our support website at:
http://support.advantech.com/
This manual is for the MIO-2364.
Part No. 2006236400 Edition 1
February 2024
iii MIO-2364 User Manual
Product Warranty (2 Years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers will be billed according to the cost of replacement mate-
rials, service time, and freight. Please consult your dealer for more details.
If you believe your product to be defective, follow the steps outlined below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages displayed when the prob-
lem occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card, and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number clearly on the outside of the package and ship the pack-
age prepaid to your dealer.
MIO-2364 User Manual iv
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables. This
type of cable is available from Advantech. Please contact your local supplier for
ordering information.
Test conditions for passing also include the equipment being operated within an
industrial enclosure. In order to protect the product from damage caused by electro-
static discharge (ESD) and EMI leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class B
This equipment has been tested and found to comply with the limits for a Class B dig-
ital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro-
vide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. However, there is no guarantee that interfer-
ence will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for assistance.
Technical Support and Assistance
1. Visit the Advantech website at www.advantech.com/support to obtain the latest
product information.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before calling:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages
Caution! There is danger of a new battery exploding if it is incorrectly installed. Do
not attempt to recharge, force open, or heat the battery. Replace the
battery only with the same or equivalent type recommended by the man-
flatterer. Discard used batteries according to the manufacturer's instruc-
tions.
v MIO-2364 User Manual
Packing List
Before you begin installing your card, please make sure that the following materials
have been shipped:
If any of these items are missing or damaged, contact your distributor or sales repre-
sentative immediately.
Optional Accessories
1 x MIO-2364 SBC
1 x SATA Cable 30cm (P/N: 1700006291)
1 x SATA Power Cable 15cm (P/N: 1700027546-01)
1 x USB 2.0 Cable 20cm (P/N: 1700030406-01)
1 x Audio Cable 20cm (P/N: 1700019584-01)
2 x COM RS-232/422/485 Cables 20cm (P/N: 1700030404-01)
1 x AT Power Cable 12 cm (P/N: 1700019705-01)
1 x Active Cooler for 15W (P/N: 1970005708T001)
1 x Passive Heatsink for 12W/6W (P/N: 1970005779T001)
1 x Startup Manual (P/N: 2046236400)
4 x Screw Kits (P/N: 96662364000)
1 x DeviceOn Package
Part number Description
TBU Heat spreader for the MIO-2364
1700034783-01 PoE/PD IN cable
1700034784-01 PoE/PD OUT cable
MIO-2364 User Manual vi
vii MIO-2364 User Manual
Contents
Chapter 1 General Information ............................1
1.1 Introduction ............................................................................................... 2
1.2 Specifications ............................................................................................ 2
Table 1.1: Specifications ............................................................. 2
1.3 Block Diagram........................................................................................... 4
Chapter 2 Mechanical ...........................................5
2.1 Introduction ............................................................................................... 6
2.2 Board Layout: Dimensions ........................................................................ 6
Figure 2.1 MIO-2364 Mechanical Drawing (Top Side) ................ 6
Figure 2.2 MIO-2364 Mechanical Drawing (Bottom Side) ........... 6
Figure 2.3 MIO-2364 Mechanical Drawing (Coastline)................ 7
Figure 2.4 MIO-2364 Mechanical Drawing (with Cooler)............. 7
Figure 2.5 MIO-2364 Mechanical Drawing (with Heatsink) ......... 8
2.3 Quick Installation Guide ............................................................................ 9
2.3.1 Cooler ........................................................................................... 9
2.3.2 Heatsink ...................................................................................... 10
Chapter 3 Installation..........................................11
3.1 Jumpers & Switches................................................................................ 12
Table 3.1: Jumpers & Switches ................................................. 12
3.2 Connectors.............................................................................................. 12
Table 3.2: Connectors ............................................................... 12
3.3 Locating Connectors ............................................................................... 13
Figure 3.1 MIO-2364 Connector Locations (Top Side).............. 13
Figure 3.2 MIO-2364 Connector Locations (Bottom Side)......... 13
3.4 Setting Jumpers ...................................................................................... 14
3.4.1 Panel Voltage Selection Jumper: VDD1 ..................................... 14
Table 3.3: Panel Voltage Selection Jumper: VDD1................... 14
3.4.2 AT Mode / Load BIOS default: J1 ............................................... 14
Table 3.4: AT Mode / Load BIOS default: J1............................. 14
3.5 Connectors (Internal) .............................................................................. 15
3.5.1 Smart FAN Internal Connector: FAN .......................................... 15
Table 3.5: Smart FAN Internal Connector: FAN ........................ 15
3.5.2 M.2 E-Key Connector: M2_1....................................................... 15
Table 3.6: M.2 E-Key Connector: M2_1 .................................... 15
3.5.3 I2C Internal Connector: CN3....................................................... 17
Table 3.7: I2C Internal Connector: CN3 .................................... 17
3.5.4 RTC Battery Connector: BAT1.................................................... 17
Table 3.8: RTC battery Connector: BAT1.................................. 17
3.5.5 COM-Port Internal Connector 1: COM1...................................... 18
Table 3.9: COM-Port Internal Connector 1: COM1 ................... 18
3.5.6 COM-Port Internal Connector 2: COM2...................................... 18
Table 3.10:COM-Port Internal Connector 2: COM2 ................... 18
3.5.7 Front Panel Internal Connector: CN1.......................................... 19
Table 3.11:Front Panel Internal Connector: CN1 ....................... 19
3.5.8 GPIO Internal Connector: CN2 ................................................... 19
Table 3.12:GPIO Internal Connector: CN2................................. 19
3.5.9 M.2 B-Key Connector: M2_B1 .................................................... 20
Table 3.13:M.2 B-Key Connector: M2_B1.................................. 20
3.5.10 LVDS Connector: LVDS1............................................................ 22
MIO-2364 User Manual viii
Table 3.14:LVDS Connector: LVDS1 ......................................... 22
3.5.11 Panel Inverter Connector: BL1 ................................................... 23
Table 3.15:Panel Inverter Connector: BL1................................. 23
3.5.12 Panel Inverter Connector: POE_PWR1...................................... 23
Table 3.16:Panel Inverter Connector: POE_PWR1 ................... 23
3.5.13 DC Power Input Connector (180D): CN4.................................... 24
Table 3.17:DC Power Input Connector (180D): CN4 ................. 24
3.5.14 DC Power Input Connector (90D): CN5...................................... 24
Table 3.18:DC Power Input Connector (90D): CN5 ................... 24
3.5.15 USB 2.0 Dual-Port Internal Connector: USB1 ............................ 24
Table 3.19:USB 2.0 Dual-Port Internal Connector: USB1.......... 24
3.6 Audio Internal Connector: AUDIO1......................................................... 25
Table 3.20:Audio Internal Connector: AUDIO1 .......................... 25
Chapter 4 AMI BIOS Setup................................. 27
4.1 Entering Setup ........................................................................................ 29
4.1.1 Main Setup.................................................................................. 29
4.1.2 Advanced BIOS Features Setup................................................. 30
4.1.3 Chipset Configuration ................................................................. 50
4.1.4 Security....................................................................................... 61
4.1.5 Boot ............................................................................................ 62
4.1.6 Save & Exit ................................................................................. 63
Appendix A System Assignments........................ 65
A.1 System I/O Ports..................................................................................... 66
Table A.1: System I/O Ports ...................................................... 66
A.2 1st MB Memory Map............................................................................... 66
Table A.2: 1st MB Memory Map ................................................ 66
A.3 Interrupt Assignments ............................................................................. 67
Table A.3: Interrupt Assignments .............................................. 67
Chapter 1
1General Information
This chapter gives background
information on the MIO-2364.
Sections include:
Introduction
Specifications
Block diagram
MIO-2364 User Manual 2
1.1 Introduction
MIO-2364 utilizes the 2.5" Pico-ITX SBC form factor (compact series, 100 x 72 mm)
and is powered by Intel® Core™ i3-N305, Intel® N-series, or Intel® Atom™ x7000E
Series processors. MIO-2364 offers embedded iManager 3.0, SUSI 4.0, and WISE-
DeviceOn, created by Advantech, to monitor and control system operation effectively
and remotely.
1.2 Specifications
Table 1.1: Specifications
Platform
Processor i3-N305 N97 x7211E
Max. Frequency 3.80 GHz 3.60 GHz 3.20 GHz
Cores/Threads 8/8 4/4 2/2
LLC 6MB 6MB 6MB
CPU TDP 15W 12W 6W
Chipset Intel® 300 Series Chipset (SoC Integrated)
BIOS AMI EFI 256Mbit
Memory
Technology DDR5-4800
Max. Capacity Up to 16GB
Channel/Socket Single Channel / One Socket
ECC Support No No No
Graphics
Controller Intel® UHD Graphics
Max. Frequency 1.25 GHz 1.20 GHz 1.00 GHz
Execution Units 32 24 16
3D/HW Acceleration
DX12, OGL4.0, OCL1.2, HW Encode: HEVC/H265,
AVC/H264, VP9, HW Decode: HEVC/H265, AVC/
H264, VP9
Display I/F
LCD 1 x LVDS, Dual Channel 18-/24-bit, up to 1920 x
1080
HDMI/DP 1 x HDMI 1.4b, up to 3840 x 2160 x 24bpp@20-30Hz
Multiple Displays Dual simultaneous displays with LVDS + HDMI
Ethernet Controller LAN: Intel® i226LM
Speed 2.5 GbE
External I/O
Ethernet 1 x RJ-45 (optional PoE/PD, 802.3at), TSN support
on x7211E only
VGA/HDMI/DP -/1/-
USB 3.2 / USB 2.0 2/-
Internal I/O
SATA 1 x SATA Gen III 6.0 Gbps
USB 2.0 2
Serial Bus SMBus/I2C
COM Port 2 x RS-232/422/485
GPIO 8-bit general purpose input output I/O
Audio Realtek ALC888s, Line-in/Line-out/MIC
Inverter 5V/12V, 2A
Smart Fan 12V, 0.3A (4-wire)
Front Panel Control Power-On, Reset, Buzzer, SATA LED, Power LED,
Case Open
3 MIO-2364 User Manual
Chapter 1 General Information
Board Features
Watchdog Timer 0~6553 sec
TPM fTPM support by Intel® Platform Trust Technology
Discrete TPM 2.0 (*optional)
iManager 3.0 SW API for Hardware Monitor, Smart Fan Control,
Brightness Control, I2C, GPIO, WDT
Expansion
M.2 E-Key 1 x E-Key 2230 (PCIe x1, USB 2.0)
M.2 B-Key 1 x B-Key 2242/3042/3052 (SATA p11-x1 or PCIe x1,
USB 2.0 x1, USB 3.0 x1) w/ Nano-SIM
Power
Supply Voltage Vin: DC 12V +/- 10%; RTC Battery: Lithium 3V/
210mAH
Connector ATX 2-pin 180D, optional ATX 2-pin 90D
Power Management AT, ATX
Max. Consumption 55.30W(12V) 43.50W(12V) 24.84W(12V)
Idle Consumption 10.38W(12V) 8.32W(12V) 10.33W(12V)
Environment
Temperature Operating: Standard: 0 ~ 60°C (32 ~ 140°F)
Storage: -40 ~ 85°C (-40 ~ 185°F)
Humidity
Operating: 40°C @ 95% relative humidity, non-con-
densing
Storage: 60°C @ 95% relative humidity, non-con-
densing
Vibration Resistance 3.5 Grms
Certification EMC CE, FCC Class B
Mechanical Dimensions 100 x 72 mm (3.9" x 2.8")
Net Weight 75 g
Note! Support by request.
Table 1.1: Specifications
MIO-2364 User Manual 4
1.3 Block Diagram
Intel Alder Lake-N
2 ~ 8 Cores/Single Tread
TDP 6 ~ 15W
LVDS
eDP-to-LVDS
CH7513
DC 12V AT/ATX
EC: IT5121
w/ErP
COM1
RS-232/422/485
COM2
RS-232/422/485
GPIO
8b WDT
2.5GbE i226LM
Invertor/SATA PWR
5V/12V@2A
I2C/
SMBus
Onboard Func.
External Conn.
Internal Conn.
PCIex1
eSPI
eDP
Smart FAN
Optional
PoE/PD or PSE
Module
DDR5-4800 SODIMM up to 16GB
TSN Support
HDA
Audio
CODEC
Audio
Line-in/out/MIC
TPM
SPI
SATA
SATA
M.2
E-Key 2230
PCIex1
USB2.0
M.2 B-Key
2242/3042/3052
SATA/PCIex1
USB3.2/2.0
Nano SIM
DDI
2 x USB 3.2
2 x USB 2.0
USB3.2/2.0
HDMI 1.4b
Default
Optional
Chapter 2
2Mechanical
This chapter provides mechanical
information on the MIO-2364.
Sections include:
Mechanical Drawings
Assembly Drawings
MIO-2364 User Manual 6
2.1 Introduction
This chapter includes board dimensions, the standard thermal solution, and optional
thermal solution along with assemby instructions.
2.2 Board Layout: Dimensions
Figure 2.1 MIO-2364 Mechanical Drawing (Top Side)
Figure 2.2 MIO-2364 Mechanical Drawing (Bottom Side)
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7 MIO-2364 User Manual
Chapter 2 Mechanical
Figure 2.3 MIO-2364 Mechanical Drawing (Coastline)
Figure 2.4 MIO-2364 Mechanical Drawing (with Cooler)
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MIO-2364 User Manual 8
Figure 2.5 MIO-2364 Mechanical Drawing (with Heatsink)
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9 MIO-2364 User Manual
Chapter 2 Mechanical
2.3 Quick Installation Guide
The MI/O compact form factor SBC is a new-generation SBC design with a variety of
mechanical improvements. Here is the quick installation guide for our thermal design.
There is a heatsink in the white box inside the package. Please assemble it by follow-
ing the diagrams below. Remember to remove the plastic on the thermal pad before
you assemble the mechanical parts.
2.3.1 Cooler
1910002596-01*4
MIO-2364
MIO-2364-Cooler
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Chapter 3
3Installation
This chapter explains the setup
procedures of the MIO-2364 hard-
ware, including instructions on
setting jumpers and connecting
peripherals, switches, and indica-
tors. Be sure to read all safety pre-
cautions before you begin the
installation procedure.
MIO-2364 User Manual 12
3.1 Jumpers & Switches
The MIO-2364 has a number of jumpers that allow you to configure your system to
suit your application. The table below lists the functions of the various jumpers.
3.2 Connectors
Onboard connectors link the MIO-2364 to external devices such as hard disk drives,
or a keyboard. The table below lists the function of each of the board's connectors.
Table 3.1: Jumpers & Switches
VDD1 Panel Voltage Selection
J1 AT Mode / Load BIOS Default
Table 3.2: Connectors
No. Connector Description
1 U17 DDR5 SO-DIMM 9.2mm Slot
2 FAN1 Smart FAN Internal Connector
3 M2_1 M.2 E-Key Connector
4 CN3 EC_I2C Port
5 BAT1 RTC Battery Connector
6 COM1 COM Port Internal Connector 1
7 COM2 COM Port Internal Connector 2
8 CN1 Front Panel Internal Connector
9 CN2 GPIO Internal Connector
10 VDD1 Panel Voltage Selection Jumper
11 SIM1 NANO SIM
12 M2_B1 M.2 B-Key Connector
13 LVDS1 LVDS Panel Connector
14 BL1 Panel Inverter Connector
15 J1 AT Mode / Load BIOS default
16 USB2 USB 3.2 Internal Connector
17 HDMI1 HDMI Connector
18 LAN1 RJ-45 Connector
19 POE_PWR1 POE Power Connector
20 CN4 DC Power Input Connector (180D)
21 CN5 DC Power Input Connector (90D)
22 SATA1 SATA Connector
23 USB1 USB 2.0 Internal Connector
24 AUDIO1 Audio Internal Connector
25 ESPI1 ESPI Debug Port
13 MIO-2364 User Manual
Chapter 3 Installation
3.3 Locating Connectors
Figure 3.1 MIO-2364 Connector Locations (Top Side)
Figure 3.2 MIO-2364 Connector Locations (Bottom Side)
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MIO-2364 User Manual 14
3.4 Setting Jumpers
You may configure your card to match the needs of your application by setting jump-
ers. A jumper is a metal bridge used to close an electric circuit. It consists of two
metal pins and a small metal clip (often protected by a plastic cover) that slides over
the pins to connect them. To “close” a jumper, you connect the pins with the clip. To
“open” a jumper, you remove the clip. Sometimes a jumper will have three pins,
labeled 1, 2 and 3. In this case you would connect either pins 1 and 2, or 2 and 3.
The jumper settings are schematically depicted in this manual as follows:
A pair of needle-nose pliers may be helpful when working with jumpers. If you have
any doubts about the best hardware configuration for your application, contact your
local distributor or sales representative before you make any changes. Generally, you
simply need a standard cable to make most connections.
3.4.1 Panel Voltage Selection Jumper: VDD1
3.4.2 AT Mode / Load BIOS default: J1
closed 2-3closedopen
Table 3.3: Panel Voltage Selection Jumper: VDD1
Jumper Short Panel Voltage
1-3 +3.3V (Default)
3-5 +5V
3-4 +12V
Table 3.4: AT Mode / Load BIOS default: J1
Jumper Short Panel Function
1-2
AT_DET# (Default)
1-2 open: ATX mode
1-2 short: AT mode*
3-4 NORMAL_BIOS (Default)
5-6
LOAD_BIOS_Default:
5-6 open: Normal*
5-6 short: Load BIOS Default
15 MIO-2364 User Manual
Chapter 3 Installation
3.5 Connectors (Internal)
3.5.1 Smart FAN Internal Connector: FAN
3.5.2 M.2 E-Key Connector: M2_1
Table 3.5: Smart FAN Internal Connector: FAN
Pin Signal Pin Definition
1 GND
2 +V12
3 FAN_SPEED
4 FAN_V5_PWM
Table 3.6: M.2 E-Key Connector: M2_1
Pin Signal Pin Definition
1 GND
2 +V3.3SB_M.2_E
3 USB8_z_P+
4 +V3.3SB_M.2_E
5 USB8_z_P-
6 NC
7 GND
8 NC
9 NC
10 NC
11 NC
12 NC
13 NC
14 NC
15 NC
16 NC
17 NC
18 GND
19 NC
20 NC
21 NC
22 NC
23 NC
32 NC
MIO-2364 User Manual 18
3.5.5 COM-Port Internal Connector 1: COM1
3.5.6 COM-Port Internal Connector 2: COM2
 
Table 3.9: COM-Port Internal Connector 1: COM1
Pin Signal Pin Definition
1 NC
2 COM1_RI#
3 COM1_DTR#
4 COM1_CTS#
5 COM1_TXD
6 COM1_RTS#
7 COM1_RXD
8 COM1_DSR#
9 COM1_DCD#
10 GND
Table 3.10: COM-Port Internal Connector 2: COM2
Pin Signal Pin Definition
1 NC
2 COM2_RI#
3 COM2_DTR#
4 COM2_CTS#
5 COM2_TXD
6 COM2_RTS#
7 COM2_RXD
8 COM2_DSR#
9 COM2_DCD#
10 GND
19 MIO-2364 User Manual
Chapter 3 Installation
3.5.7 Front Panel Internal Connector: CN1
3.5.8 GPIO Internal Connector: CN2
Table 3.11: Front Panel Internal Connector: CN1
Pin Signal Pin Definition
1 GND
2 BUZZER-
3 BUZZER+
4 NC
5 SATA_HDD_LED#
6 FP_a_PSIN#
7 FP_a_RST#
8 +V3.3
9 NC
10 +V5
Table 3.12: GPIO Internal Connector: CN2
Pin Signal Pin Definition
1 GND
2 EC_P1_GPIO7
3 EC_P1_GPIO2
4 EC_P1_GPIO6
5 EC_P1_GPIO1
6 EC_P1_GPIO5
7 EC_P1_GPIO0
8 EC_P1_GPIO4
9 +V5_P1_GPIO
10 EC_P1_GPIO3
MIO-2364 User Manual 20
3.5.9 M.2 B-Key Connector: M2_B1
Table 3.13: M.2 B-Key Connector: M2_B1
Pin Signal Pin Definition
1 M2B1_CFG3
2 +V3.3A_M.2_B
3 GND
4 +V3.3A_M.2_B
5 GND
6 M2B1_FULL_CARD_OFF#
7 USB_M2B1_P
8 M2B1_W_DISABLE1#
9 USB_M2B1_N
10 M2B1_LED1#
11 GND
20 M2B1_PCIE_DIS
21 M2B1_CFG0
22 M2B1_ANT_CFG
23 M2B1_WAKE_ON_WWAN#
24 M2B1_ANT_TUNER
25 M2B1_DPR
26 M2B1_W_DISABLE2#
27 GND
28 NC
29 M2B1_USB31_RX-
30 M2B1_UIM_RESET
31 M2B1_USB31_RX+
32 M2B1_UIM_CLK
33 GND
34 M2B1_UIM_DATA
35 M2B1_USB31_TX-
36 M2B1_UIM_PWR
37 M2B1_USB31_TX+
38 NC
39 GND
40 NC
41 MSATA_MPCIE_RX-
42 NC
43 MSATA_MPCIE_RX+
44 NC
45 GND
46 NC
47 MSATA_MPCIE_TX-
48 NC
49 MSATA_MPCIE_TX+
50 M2B1_PERST#
51 GND
21 MIO-2364 User Manual
Chapter 3 Installation
52 M2B1_a_CLKREQ#
53 CLK100M_a_M2B1-
54 M2B1_PCIEWAKE#
55 CLK100M_a_M2B1+
56 NC
57 GND
58 NC
59 NC
60 NC
61 NC
62 NC
63 NC
64 NC
65 NC
66 NC
67 M2B1_a_RESET#
68 M2B1_SUSCLK
69 M2B1_CFG1
70 +V3.3A_M.2_B
71 GND
72 +V3.3A_M.2_B
73 GND
74 +V3.3A_M.2_B
75 M2B1_CFG2
H1 NC
H2 NC
H3 GND
H4 GND
Table 3.13: M.2 B-Key Connector: M2_B1
MIO-2364 User Manual 22
3.5.10 LVDS Connector: LVDS1
Table 3.14: LVDS Connector: LVDS1
Pin Signal Pin Definition
1 +V_LCD
2 +V_LCD
3 GND
4 GND
5 +V_LCD
6 +V_LCD
7 LVDS1_0_D0-
8 LVDS1_1_D0-
9 LVDS1_0_D0+
10 LVDS1_1_D0+
11 GND
12 GND
13 LVDS1_0_D1-
14 LVDS1_1_D1-
15 LVDS1_0_D1+
16 LVDS1_1_D1+
17 GND
18 GND
19 LVDS1_0_D2-
20 LVDS1_1_D2-
21 LVDS1_0_D2+
22 LVDS1_1_D2+
23 GND
24 GND
25 LVDS1_0_CLK-
26 LVDS1_1_CLK-
27 LVDS1_0_CLK+
28 LVDS1_1_CLK+
29 GND
30 GND
31 LVDS0_DDCCLK_AUX+
32 LVDS0_DDCCLK_AUX-
33 GND
34 GND
35 LVDS1_0_D3-
36 LVDS1_1_D3-
37 LVDS1_0_D3+
38 LVDS1_1_D3+
39 NC
40 LVDS1_VCON
41 NC
42 NC
43 NC
44 NC
23 MIO-2364 User Manual
Chapter 3 Installation
3.5.11 Panel Inverter Connector: BL1
3.5.12 Panel Inverter Connector: POE_PWR1
Table 3.15: Panel Inverter Connector: BL1
Pin Signal Pin Definition
1 +V5_1_INVERTER_0
2 EC_LVDS1_z_PWM
3 LVDS1_z_ENABKL
4 GND
5 +V12_1_INVERTER_0
Table 3.16: Panel Inverter Connector: POE_PWR1
Pin Signal Pin Definition
1 +V48_LAN2+
2 +V48_LAN2-
3 GND
4 +V12_A
MIO-2364 User Manual 24
3.5.13 DC Power Input Connector (180D): CN4
3.5.14 DC Power Input Connector (90D): CN5
3.5.15 USB 2.0 Dual-Port Internal Connector: USB1
Table 3.17: DC Power Input Connector (180D): CN4
Pin Signal Pin Definition
1 +V12_DCIN
2 GND
Table 3.18: DC Power Input Connector (90D): CN5
Pin Signal Pin Definition
1 GND
2 +V12_DCIN
Table 3.19: USB 2.0 Dual-Port Internal Connector: USB1
Pin Signal Pin Definition
1 +V5SB_USB_UTC
2 +V5SB_USB_UTC
3 USB6_z_P-
4 USB7_z_P-
5 USB6_z_P+
6 USB7_z_P+
7 GND
8 GND
9 GND
10 NC
25 MIO-2364 User Manual
Chapter 3 Installation
3.6 Audio Internal Connector: AUDIO1
 
Table 3.20: Audio Internal Connector: AUDIO1
Pin Signal Pin Definition
1 LOUTR
2 LINR
3 AUD_CONN_GND
4 AUD_CONN_GND
5 LOUTL
6 LINL
7 AUD_CONN_GND
8 FRONT_JD
9 MIC1R
10 MIC1L
MIO-2364 User Manual 26
Chapter 4
4AMI BIOS Setup
MIO-2364 User Manual 28
AMIBIOS has been integrated into many motherboards for over a decade. With the
AMIBIOS Setup program, you can modify BIOS settings and control the various sys-
tem features. This chapter describes the basic navigation of the MIO-2364 BIOS
setup screens.
AMIBIOS ROM has a built-in setup program that allows users to modify the basic
system configuration. This information is stored in battery-backed CMOS so it retains
the setup information when the power is turned off.
29 MIO-2364 User Manual
Chapter 4 AMI BIOS Setup
4.1 Entering Setup
Turn on the computer and check for the patch code. If there is a number assigned to
the patch code, it means that the BIOS supports your CPU. If there is no number
assigned to the patch code, please contact an Advantech application engineer to
obtain an up-to-date patch code file. This will ensure that your CPU‘s system status is
valid. After ensuring that you have a number assigned to the patch code, press
<DEL> and you will immediately be allowed to enter Setup.
4.1.1 Main Setup
When you first enter the BIOS Setup Utility, you will encounter the Main setup screen.
You can always return to the Main setup screen by selecting the Main tab. There are
two Main setup options. They are described in this section. The Main BIOS Setup
screen is shown below.
The Main BIOS setup screen has two main frames. The left frame displays all the
options that can be configured. Grayed-out options cannot be configured; options in
blue can. The right frame displays the key legend.
Above the key legend is an area reserved for a text message. When an option is
selected in the left frame, it is highlighted in white. Often a text message will accom-
pany it.
System Time / System Date
Use this option to change the system time and date. Highlight System Time or Sys-
tem Date using the <Arrow> keys. Enter new values through the keyboard. Press the
<Tab> key or the <Arrow> keys to move between fields. The date must be entered in
MM/DD/YY format. The time must be entered in HH:MM:SS format.
MIO-2364 User Manual 30
4.1.2 Advanced BIOS Features Setup
Select the Advanced tab from the MIO-2364 setup screen to enter the Advanced
BIOS Setup screen. You can select any of the items in the left frame of the screen,
such as CPU Configuration, to go to the sub-menu for that item. You can display an
Advanced BIOS Setup option by highlighting it using the <Arrow> keys. All Advanced
BIOS Setup options are described in this section. The Advanced BIOS Setup screen
is shown below. The sub-menus are described on the following pages.
MIO-2364 User Manual 32
4.1.2.2 WWAN Configuration
WWAN Device
Select the M.2 WWAN Device options to enable 5G-M80 (MediaTek) modems.
33 MIO-2364 User Manual
Chapter 4 AMI BIOS Setup
4.1.2.3 CPU Configuration
C6DRAM
Enable/Disable the moving of DRAM contents to PRM memory when the CPU is in
the C6 state.
CPU Flex Ratio Override
Enable/Disable CPU Flex Ratio Programming.
Hardware Prefetcher
This item allows users to enable or disable the hardware prefetcher feature.
Adjacent Cache Line Prefetch
This item allows users to enable or disable the adjacent cache line prefetch feature.
Intel (VMX) Virtualization Technology
When enabled, a VMM can utilize the additional hardware capability provided by
Vanderpool Technology.
AVX
Enable/Disable the AVX 2/3 instructions.
Active Efficient-cores
Number of E-cores to enable in each processor package.
AES
Enable/Disable AES (Advanced Encryption Standard).
MachineCheck
Enable/Disable Machine Check.
MonitorMWait
Enable/Disable MonitorMWait.
Intel Trusted Execution Technology
Enables utilization of additional hardware capability provided by Intel® Trusted Exe-
cution Technology.
MIO-2364 User Manual 34
4.1.2.4 Power & Performance
CPU – Power Management Control
CPU – Power Management Control options.
GT – Power Management Control
GT – Power Management Control options.
CPU - Power Management Control
MIO-2364 User Manual 36
Energy Efficient P-state
Enable/Disable Energy Efficient P-state feature.
Package Power Limit MSR Lock
Enable/Disable locking of Package Power Limit settings.
Power Limit 1 Override
Enable/Disable Power Limit 1 override.
Power Limit 2 Override
Enable/Disable Power Limit 2 override.
Power Limit 2
Power Limit 2 value in milliwatts; BIOS will round to the nearest 1/8W when program-
ming.
Energy Efficient Turbo
Enable/Disable the Energy Efficient Turbo feature.
Config TDP Configurations
E-core Turbo Ratio Limit Numcore x
Efficient-core Turbo Ratio Limit Numcore x defines the core range.
37 MIO-2364 User Manual
Chapter 4 AMI BIOS Setup
Power Limit 3 Settings
Power Limit 3 Override
Enable/Disable Power Limit 3 override.
GT - Power Management Control
RC6(Render Standby)
Check to enable render standby support.
MIO-2364 User Manual 38
Maximum GT frequency
Maximum GT frequency limited by user.
Disable Turbo GT frequency
Enabled/Disable Turbo GT frequency.
4.1.2.5 PCH-FW Configuration
ME State
When disabled, ME will be put into Temporarily Disabled Mode.
ME Unconfig on RTC Clear
When disabled, ME will not be unconfigured on RTC Clear.
Core BIOS Done Message
Enable/Disable Core BIOS Done message sent to ME.
Firmware Update Configuration
Configure Management Engine Technology parameters.
39 MIO-2364 User Manual
Chapter 4 AMI BIOS Setup
4.1.2.6 ACPI Settings
Enable ACPI Auto Configuration
Enable/Disable BIOS ACPI auto configuration.
Enable Hibernation
Enable/Disable the ability to hibernate (OS/S4 Sleep State). This option may not be
available with some OS.
ACPI Sleep State
Select the highest ACPI sleep state the system will enter when the SUSPEND button
is pressed.
PCIE Wake
Enable/Disable PCIE to wake the system from S5.

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Model: MIO-2364N-P6A1

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