Instrukcja obsługi Supermicro X12SPW-F

Supermicro płyta główna X12SPW-F

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USER'S MANUAL

Revision 1.1c

X12SPW-TF/-F

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer

assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment

to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual

at any time and without notice. This product, including software and documentation, is the property of Supermicro and/

or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except

as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,

SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT

OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER

MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED

OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,

INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the

State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution

of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in industrial environment. This equipment generates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,

may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely

to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only

to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.

See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate

WARNING: Handling of lead solder materials used in this product may expose you to lead, a

chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,

nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products

for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully

indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and

proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.1c

Release Date: October 27, 2022

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Printed in the United States of America

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.

It provides information for the installation and use of the X12SPW-TF/F motherboard.

About This Motherboard

The Supermicro X12SPW-TF/F supports the 3rd Generation Intel® Xeon Scalable series

Socket P+ (LGA4189) processor with up to 40 cores and a thermal design power (TDP) of

up to 270W. Built with the Intel PCH chipset, the X12SPW-TF/F supports 8-channel, 8-DIMM

DDR4 ECC 3DS RDIMM/LRDIMM memory with speeds of up to 3200MHz, three PCIe slots,

SATA 3.0 ports, a M.2 slot, and a Trusted Platform Module (TPM) header. The X12SPW-TF/F

is optimized for high-performance, high-end computing platforms that address the needs

of next generation server applications. Please note that this motherboard is intended to be

installed and serviced by professional technicians only. For processor/memory updates, refer

to our website at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates high voltage may be encountered while performing a procedure.

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to di󰀨erentiate various models or provides infor-

mation for proper system setup.

Specyfikacje produktu

Marka:	Supermicro
Kategoria:	płyta główna
Model:	X12SPW-F
Szerokość produktu:	203 mm
Głębokość produktu:	330 mm
Przeznaczenie:	Serwer
Ilość portów Ethernet LAN (RJ-45):	2
Zakres temperatur (eksploatacja):	-40 - 70 °C
Zakres wilgotności względnej:	8 - 90 %
Kod zharmonizowanego systemu (HS):	84733020
Kanały wyjścia audio:	- kan.
Liczba portów USB 2.0:	2
Przewodowa sieć LAN:	Tak
Zakres temperatur (przechowywanie):	0 - 50 °C
Dopuszczalna wilgotność względna:	5 - 95 %
Usługa RAID:	Tak
Producent procesora:	Intel
Ilość portów USB 3.2 Gen 1 (3.1 Gen 1) Typu-A:	3
Obsługiwane rodzaje pamięci:	DDR4-SDRAM
Typ slotów pamięci:	DIMM
Liczba gniazd pamięci:	8
Obsługiwane prędkości zegara pamięci:	3200 MHz
Maksymalna pojemność pamięci:	2000 GB
Gniazdo procesora:	LGA 3647 (Socket P)
Procesor:	Intel® Xeon®
Rodzina płyt z chipsetami:	Intel
Układ płyty głównej:	Intel® C621
Poziomy raid:	0, 1,5, 10
Typ BIOS:	UEFI AMI
Liczba gniazd M.2 (M):	1
Ilość złączy SATA III:	10
Ilość gniazd USB 2.0:	2
Łącza USB 3.2 Gen 1 (3.1 Gen 1):	2
Złącze TPM:	Tak
Wspierane interfejsy dysków twardych:	M.2, SATA
Rodzaj interfejsu sieci Ethernet:	10 Gigabit Ethernet
Kontroler LAN:	Intel® X550
Liczba portów VGA (D-Sub):	1
Korekcja ECC:	Tak
Monitorowanie stanu komputera:	LED, Temperature, FAN, Voltage
Wersja ACPI:	6.0
Wersja systemu BIOS (SMBIOS):	3.0
Model karty graficznej on-board:	Aspeed AST2600
Napięcie pamięci:	1.2 V
Ilość portów COM:	2
Gniazda PCI Express x16 (Gen 4.x):	1