Instrukcja obsługi Microchip SY58606U

Microchip nieskategoryzowany SY58606U

Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Microchip SY58606U (24 stron) w kategorii nieskategoryzowany. Ta instrukcja była pomocna dla 6 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek

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2019 Microchip Technology Inc. DS20006199A-page 1
SY58606U
Features
• Precision 1:2, 400 mV CML Fanout Buffer
• Guaranteed AC Performance over Temperature
and Voltage:
- DC-to >4.25 Gbps Throughput
- <320 ps Propagation Delay (IN-to-Q)
- <15 ps Within-Device Skew
- <85 ps Rise/Fall Times
• Fail Safe Input
- Prevents Outputs From Oscillating When
Input is Invalid
• Ultra-Low Jitter Design
- 100 fsRMS Typical Additive Jitter
• High-Speed CML Outputs
• 2.5V ±5% or 3.3V ±10% Power Supply Operation
• Industrial Temperature Range: –40°C to +85°C
• Available In 16-lead (3 mm x 3 mm) QFN
Package
Applications
• Data Distribution: OC-48, OC-48+FEC, XAUI
• SONET Clock and Data Distribution
• Fibre Channel Clock and Data Distribution
• Gigabit Ethernet Clock And Data Distribution
Markets
• Storage
• ATE
• Test and Measurement
• Enterprise Networking Equipment
• High-End Servers
• Access
• Metro Area Network Equipment
General Description
The SY58606U is a 2.5/3.3V, high-speed, fully
differential 1:2 CML fanout buffer optimized to provide
two identical output copies with less than 15 ps of skew
and 100 fsRMS of typical additive phase jitter. The
SY58606U can process clock signals as fast as 3 GHz
or data patterns up to 4.25 Gbps.
The differential input includes Microchip’s unique,
3-lead input termination architecture that interfaces to
LVPECL, LVDS, or CML differential signals, (AC- or
DC-coupled) as small as 100 mV (200 mVPP) without
any level-shifting or termination resistor networks in the
signal path. For AC-coupled input interface
applications, an integrated voltage reference (V
REF-AC)
is provided to bias the VT pin. The outputs are 400 mV
CML, with extremely fast rise/fall times guaranteed to
be less than 85 ps.
The SY58606U operates from a 2.5V ±5% supply or
3.3V ±10% supply and is guaranteed over the full
industrial temperature range (–40°C to +85°C). For
applications that require LVPECL or LVDS outputs,
consider Microchip’s SY58607U and SY58608U, 1:2
fanout buffers with 800 mV and 325 mV output swings
respectively. The SY58606U is part of Microchip’s
high-speed, Precision Edge® product line.
Package Type
SY58606U
3 mm x 3 mm QFN-16 (M)
(Top View)
13141516
12
11
10
9
1
2
3
4
8765
IN
VT
VREF-AC
/IN
Q0
/Q0
Q1
/Q1
VCC
GND
GND
VCC
VCC
GND
GND
VCC
4.25 Gbps Precision, 1:2 CML Fanout Buffer with Internal Termination and
Fail Safe Input
SY58606U
DS20006199A-page 2 2019 Microchip Technology Inc.
Functional Block Diagram
Q1
/Q1
IN
/IN
VT
50Ω
50Ω
Q0
/Q0
VREF-AC
2019 Microchip Technology Inc. DS20006199A-page 3
SY58606U
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VCC) ................................................................................................................................ –0.5V to +4.0V
Input Voltage (VIN) ....................................................................................................................................... –0.5V to V
CC
CML Output Voltage (VOUT) .....................................................................................................V
CC – 1.0V to VCC + 0.5V
Current (IT)
Source or Sink on VT Pin.........................................................................................................................±100 mA
Input Current
Source or Sink Current on, IN, /IN..............................................................................................................±50 mA
Current (IREF)
Source or Sink Current on VREF-AC (Note 1) ......................................................................................... ±1.5 mA
Maximum Operating Junction Temperature ..........................................................................................................+125°C
Lead Temperature (Soldering, 20 sec.)................................................................................................................. +260°C
Storage Temperature (TS) ......................................................................................................................–65°C to +150°C
Operating Ratings ††
Supply Voltage (VCC) .......................................................................................................................... +2.375V to +3.60V
Ambient Temperature (TA) .......................................................................................................................–40°C to +85°C
Package Thermal Resistance (Note 2)
QFN-16, Still-Air (θJA) .......................................................................................................................................... 60°C/W
QFN-16, Junction-to-Board (ΨJB) ........................................................................................................................ 33°C/W
† Notice: Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only
and functional operation is not implied at conditions other than those detailed in the operational sections of this data
sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
†† Notice: The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 1: Due to the limited drive capability, use for input of the same package only.
2: Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative
potential on the PCB. ΨJB and θJA values are determined for a 4-layer board in still-air number, unless oth-
erwise stated.

Specyfikacje produktu

Marka: Microchip
Kategoria: nieskategoryzowany
Model: SY58606U

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