Instrukcja obsługi Microchip MCP96L01


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2022
Microchip Technology Inc. and its subsidiaries DS50003254A
MCP9601
Thermocouple IC
Evaluation Board
User’s Guide
DS50003254A-page 2
2022
Microchip Technology Inc. and its subsidiaries
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this informa-
tion in any other manner violates these terms. Information
regarding device applications is provided only for your conve-
nience and may be superseded by updates. It is your responsi-
bility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
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services.
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Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-
Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
ISBN: 978-1-5224-9709-7
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
MCP9601 THERMOCOUPLE IC
EVALUATION BOARD
USER’S GUIDE
2022
Microchip Technology Inc. and its subsidiaries
. DS50003254A-page 3
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in This Guide........................................................................... 6
Recommended Reading........................................................................................ 7
The Microchip Website.......................................................................................... 7
Customer Support ................................................................................................. 7
Revision History .................................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What is the MCP9601 Device? ...................................................................... 9
1.3 What is the MCP9601 Thermocouple IC Evaluation Board? ......................... 9
1.4 What the MCP9601 Thermocouple IC Evaluation Board Kit Contains ........... 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Required Tool ............................................................................................... 11
2.3 Getting Started ............................................................................................. 11
2.3.1 Hardware Setup ........................................................................................ 11
2.3.2 Hardware Operation .................................................................................. 12
2.4 Microchip Thermal Management Software GUI ........................................... 12
2.5 Configuring the MCP9601 ............................................................................ 15
2.5.1 MCP9600 vs. MCP9601 Additional Features ............................................ 15
2.5.2 How to Check for Open Circuit and Short Circuit Conditions .................... 16
2.6 Data Acquisition ........................................................................................... 16
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 19
A.2 Schematic 1 ................................................................................................. 20
A.3 Schematic 2 ................................................................................................. 21
A.4 Board – Top Silk .......................................................................................... 22
A.5 Board – Top Copper and Silk ....................................................................... 22
A.6 Board – Top Copper .................................................................................... 23
A.7 Board – Bottom Copper ............................................................................... 23
A.8 Board – Bottom Copper and Silk ................................................................. 24
A.9 Board – Bottom Silk ..................................................................................... 24
Appendix B. Bill of Materials (BOM)........................................................................... 25
Worldwide Sales and Service .................................................................................... 27


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Marka: Microchip
Kategoria: nieskategoryzowany
Model: MCP96L01

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