Instrukcja obsługi Microchip LAN8651

Microchip Niesklasyfikowane LAN8651

Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Microchip LAN8651 (12 stron) w kategorii Niesklasyfikowane. Ta instrukcja była pomocna dla 6 osób i została oceniona przez 2 użytkowników na średnio 4.5 gwiazdek

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2023 Microchip Technology Inc. and its subsidiaries DS60001746B - page 1
1.0 INTRODUCTION
This document provides a hardware design checklist for the Microchip LAN8650/1. These checklist items should be fol-
lowed when utilizing the LAN8650/1 in a new design. A summary of these items is provided in Section 11.0, HARD-
WARE CHECKLIST SUMMARY. Detailed information on the following topics can be found in the corresponding section:
Section 1.0, INTRODUCTION
Section 2.0, GENERAL CONSIDERATIONS
Section 2.1, Pin Check
Section 3.0, POWER AND GROUND
Section 3.1, Power
Section 3.2, Ground
Section 4.0, CLOCK CIRCUIT
Section 5.0, ETHERNET PHY EXTERNAL BIN
Section 6.0, SPI (SERIAL PERIPHERAL INTERFACE)
Section 7.0, RESET
Section 8.0, POWER MANAGEMENT PINS
Section 9.0, CONFIGURABALE PINS
Section 10.0, MISCELLANEOUS
Section 10.1, RBIAS
Section 10.2, TEST
Section 10.3, DO NOT CONNECT
Section 11.0, HARDWARE CHECKLIST SUMMARY
LAN8650/1
Hardware Design Checklist
LAN8650/1
DS60001746B - page 2 2023 Microchip Technology Inc. and its subsidiaries
2.0 GENERAL CONSIDERATIONS
2.1 Pin Check
Check the pinout of the part against the data sheet. Ensure each pin matches the data sheet and is configured as input,
output, or bidirectional.
3.0 POWER AND GROUND
3.1 Power
The LAN8651 contains an integrated 1.8V regulator and only requires a single 3.3V supply while the LAN8650 requires
both 3.3V and 1.8V external supplies.
• The digital pin supply, VDDP, is connected to a 3.3V supply.
• The analog supply, VDDA, is connected to a 3.3V supply. This connection may be through an optional ferrite
bead. If a ferrite bead is used, a large bulk capacitor (typically 10 µF) should be placed in between the ferrite bead
and the pin decoupling capacitors. The ferrite bead and bulk capacitor should be placed where the power supply
sources the local 3.3V power plane and as close as possible to the LAN8650/1.
• The continuous analog supply, VDDAU, is connected to a 3.3V continuous supply if low-power sleep mode is
used. If sleep mode is not used, it is connected to the same supply as VDDA.
• The core supply, VDDC, is connected to a 1.8V supply.
• The LAN8651 CCOMP pin requires a 4.7 µF low ESR metal film capacitor connected to the PCB ground plane.
• The LAN8650 1.8V power supply must never exceed the 3.3V supply by more than 0.5V. To satisfy this power
sequencing requirement, a Schottky diode is recommended between the supplies to prevent the lower voltage
supply from exceeding the higher supply by more than a forward diode drop. If used, the diode must be sized
appropriately according to the LAN8650 3.3V supply and the forward voltage drop must be less than 0.5V when
the diode conducts current.
• Each individual VDDP VDDA VDDAU, , and VDDC power pin requires a 0.01 µF and 0.1 µF decoupling capacitor.
• During layout, the smallest value capacitor, 0.01 µF, must have priority and be placed closest to the respective
power pin. The tightest decoupling capacitor placement is underneath the device on the opposite side of the
board. Each capacitor should have a dedicated power and ground vias. Vias should not be shared.
• The VDDA VDDAU pin must never exceed the pin by more than 0.5V, including during power-up and power-
down. Use optional Schottky diode for power sequencing.
• LAN8650 only: The VDDC pin must not exceed the VDDP pin by more than 0.5V, including during power-up and
power-down. Use optional Schottky diode for power sequencing.
TABLE 3-1: POWER PINOUT
LAN8650 LAN8651
VDDP Pin 7, Pin 17 Pin 7, Pin 17
VDDAU Pin 25 Pin 25
VDDA Pin 29 Pin 29
VDDC Pin 6, Pin 15, Pin 21
CCOMP Pin 21
2023 Microchip Technology Inc. and its subsidiaries DS60001746B - page 3
LAN8650/1
The LAN8650 Power supply connections is shown in . The LAN8651 Power supply connections is shown inFigure 3-1
Figure 3-2.
FIGURE 3-1: LAN8650 POWER CONNECTIVITY
LAN8650
GND (ePAD)
3.3Vcont†
3.3Vsw
10 PF
†
3.3 V continuous power only required for low-power network activity wake-up applicat ions.
Connect VDDAU to 3.3 V switched power if network activity wake-up is not used.
Optional Supply
Sequencing Diodes
3.3Vcont†
3.3Vsw
Ferrite Bead
(optional)
VDDAU† (25)
3.3Vsw1.8Vsw
VDDA (29)
VDDP (7)
VDDP (17)
VDDC (6)
VDDC (15)
VDDC (21)
1.8Vsw
10 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
0.1 PF 0.01 PF
10 PF

Specyfikacje produktu

Marka: Microchip
Kategoria: Niesklasyfikowane
Model: LAN8651

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