Instrukcja obsługi Asrock H55M-LE

Asrock płyta główna H55M-LE

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H55M-LE

User Manual

Version 1.0

Published January 2010

No part of this manual may be reproduced, transcribed, transmitted, or translated in

any language, in any form or by any means, except duplication of documentation by

the purchaser for backup purpose, without written consent of ASRock Inc.

Products and corporate names appearing in this manual may or may not be regis-

tered trademarks or copyrights of their respective companies, and are used only for

identification or explanation and to the owners’ benefit, without intent to infringe.

Specifications and information contained in this manual are furnished for informa-

tional use only and subject to change without notice, and should not be constructed

as a commitment by ASRock. ASRock assumes no responsibility for any errors or

omissions that may appear in this manual.

With respect to the contents of this manual, ASRock does not provide warranty of

any kind, either expressed or implied, including but not limited to the implied warran-

ties or conditions of merchantability or fitness for a particular purpose.

In no event shall ASRock, its directors, officers, employees, or agents be liable for

any indirect, special, incidental, or consequential damages (including damages for

loss of profits, loss of business, loss of data, interruption of business and the like),

even if ASRock has been advised of the possibility of such damages arising from any

defect or error in the manual or product.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

The Lithium battery adopted on this motherboard contains Perchlorate, a toxic

substance controlled in Perchlorate Best Management Practices (BMP) regulations

passed by the California Legislature. When you discard the Lithium battery in

California, USA, please follow the related regulations in advance.

“Perchlorate Material-special handling may apply, see

www.dtsc.ca.gov/hazardouswaste/perchlorate”

ASRock Website: http://www.asrock.com

1.1 Package Contents .......................................................... 5

1.2 Specifications ................................................................ 6

1.3 Motherboard Layout ...................................................... 11

1.4 I/O Panel ......................................................................... 12

2.1 Screw Holes ................................................................. 14

2.2 Pre-installation Precautions ........................................... 14

2.3 CPU Installation .............................................................. 15

2.4 Installation of Heatsink and CPU fan ............................. 17

2.5 Installation of Memory Modules (DIMM) ......................... 18

2.6 Expansion Slots (PCI and PCI Express Slots) ..................... 19

2.7 Jumpers Setup .............................................................. 20

2.8 Onboard Headers and Connectors .............................. 21

2.9 HDMI_SPDIF Header Connection Guide ......................... 25

2.10 SATAII Hard Disk Setup Guide ....................................... 26

2.11 Serial ATA (SATA) / Serial ATAII (SATAII) Hard Disks

Installation ...................................................................... 27

2.12 Hot Plug Function for SATA / SATAII HDDs .................. 27

2.13 SATA / SATAII HDD Hot Plug Feature and Operation

Guide .............................................................................. 28

2.14 Driver Installation Guide ................................................. 30

2.15 Installing Windows®

7 / 7 64-bit / VistaTM / VistaTM 64-bit

/ XP / XP 64-bit ............................................................... 30

2.15.1 Installing Windows

® XP / XP 64-bit .................... 30

2.15.2 Installing Windows® 7 / 7 64-bit / VistaTM /

Vista

TM 64-bit ..................................................... 30

2.16 Untied Overclocking Technology ................................... 31

3.1.1 BIOS Menu Bar .................................................... 32

3.1.2 Navigation Keys ................................................... 32

3.2 Main Screen ................................................................... 33

3.3 OC Tweaker Screen ...................................................... 34

3.4 Advanced Screen ......................................................... 38

3.4.1 CPU Configuration................................................ 39

3.4.2 Chipset Configuration .......................................... 41

3.4.3 ACPI Configuration ............................................... 42

3.4.4 Storage Configuration ......................................... 43

Specyfikacje produktu

Marka:	Asrock
Kategoria:	płyta główna
Model:	H55M-LE
Rodzaj zasilania:	ATX
Szerokość produktu:	244 mm
Głębokość produktu:	203 mm
Certyfikaty:	FCC, CE, WHQL
Ilość portów Ethernet LAN (RJ-45):	1
Kanały wyjścia audio:	7.1 kan.
Liczba portów USB 2.0:	6
Producent procesora:	Intel
Liczba gniazd pamięci:	2
Bez kody korekcyjnego:	Tak
Maksymalna pojemność pamięci:	8 GB
Gniazdo procesora:	LGA 1156 (Socket H)
Rodzaj płyty:	micro ATX
PCI Express x1 slots:	1
PCI Express x16 gniazda:	1
Gniazdo zasilania ATX (24-pin):	Tak
Ilość gniazd USB 2.0:	2
Gniazdo wentylatora procesora:	Tak
Złącze audio na przednim panelu:	Tak
Gniazdo na obudowie:	Tak
Liczba portów PS/2:	1
Ilość portów DVI-D:	1
Zawiera sterowniki:	Tak
Układ audio:	VIA VT1718S
Kontroler LAN:	Realtek RTL8111D(L)
Złącze wentylatora:	Tak
Liczba portów VGA (D-Sub):	1
System operacyjny:	Win XP, Vista, 7
Cechy sieci:	10/100/1000 Mbps
Pamięć karty graficznej podsystemu graficznego:	1759 MB
Rozmiar pamięci BIOS:	16 Mbit
Karta graficzna on-board:	Tak
Ilość gniazd SATA:	4
Ilość gniazd COM:	1
Sloty PCI:	2